Thailand’s Smartphone Market Grew 17.1% in 2024 to 16.9 Million Units
February 13, 2025 | IDCEstimated reading time: 1 minute
According to International Data Corporation ’s (IDC) Worldwide Quarterly Mobile Phone Tracker, Thailand’s smartphone market shipped 16.9 million units in 2024, marking a 17.1% year-on-year (YoY) growth. There was a 14% increase in shipment volume in 1H24, with the growth increasing to 20% in 2H24. The market shipped 4.7 million units in 4Q24, marking a 27% increase YoY driven by an influx of mass-market, entry-level models from major vendors.
Despite a lackluster economy—albeit with higher GDP growth than in 2023—the market in 2024 was bolstered by a strong vendor push amidst intense competition as well as the increasing proliferation of financing programs.
The entry-level smartphone segment (<US$200) increased to 56.9% of the market, up from 54.8% the year before. On the other hand, the premium segment (US$1,000+) decreased in share to 9% compared to 12% the year before. There was particularly strong growth in the ultra-low-end segment (<US$100) and the mid-to-high-end segment (US$400<US$800), which grew from 11% to 14% and 9.5% to 12.8% share, respectively. The Average Selling Price of the total market was US$336, falling 7.5% in 2024.
The share of 5G smartphones increased to 45.6%, up from 43.2% in 2023, driven by the lower starting price and wider availability of affordable 5G Android models, as well as an increasing consumer appetite for 5G phones.
“With the market rebounding strongly in 2024 following two consecutive years of decline, vendors should continue to pursue growth. Despite macroeconomic and political uncertainty, vendors and channel partners are looking at market opportunities arising from government stimulus programs as well as increased affordability through financing plans.” said Apirat Ratanavichit, research analyst, IDC Thailand.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).