Just Because You Can, Doesn’t Mean You Should
March 20, 2025 | Tony Plemel, Flexible Circuit TechnologiesEstimated reading time: 1 minute
Decisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits.
For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors:
- Required layer count
- The size and shape based upon limited space
- Components on one side or both sides of a rigid or stiffened area
- Electrical, mechanical needs
- Layer stackup
These factors need to be carefully weighed on their own merit, and on how they interact with each other, in order to arrive at the most reliable and cost-effective design.
Let’s say a customer comes to me with a four-layer rigid-flex circuit design where the rigid copper-clad material is on the top and the flex copper-clad is on the bottom.
To read this entire article, which appeared in the March 2025 issue of Design007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Webinar Review: The Challenges of UL Certification for Flex and Flex-Rigid PCBs
03/25/2026 | Marcy LaRont, I-Connect007 MagazineUL certification is one of an engineer’s least favorite topics, yet it is critically important. The process is complicated but relatively straightforward for standard rigid PCBs, but as Jan Pedersen makes clear in NCAB Group’s recent webinar, “UL Approval for Flex and Flex-Rigid PCBs,” it is a very different story.
AdvancedPCB Expands HDI Inspection Capabilities at Orange County Facility
01/30/2026 | AdvancedPCBAdvancedPCB, a leading U.S. printed circuit board manufacturer, installed a new Galaxy 25µ CIMS automated optical inspection (AOI) system at its Orange County facility, strengthening inspection performance for HDI and advanced multilayer PCB production and providing customers with greater confidence as designs move through manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/21/2025 | Michelle Te, I-Connect007Were you one of the lucky ones who made it to Europe’s largest electronics trade show this week? By all accounts, this massive event was buzzing with new technologies, packed booths, and plenty of tired feet by the end of each day. So, if you’re heading home from productronica (or, like me, just enjoying the end of a busy week), now’s the perfect time to unwind a bit. Settle into that airplane seat (or office chair), grab a snack, and catch up on some great reads from I-Connect007.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.