Elephantech: For a Greener Tomorrow
April 16, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes

Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Marcy LaRont: Nobu, can you explain this process of inkjet metallization?
Nobu Okamoto: We directly print on the substrate and then add the plating to reduce the etching and washing process for flexible printed circuit (FPC) production or rigid PCB production. We have already succeeded for three years in mass production and commercializing the single-layer FPC. I think this is a very rare case in printed electronics to have already been commercialized and succeeded.
At the end of last year, we successfully created a sample of multilayer FR-4. We are now looking for a partner to collaborate with on this project. Additionally, this technology can also be adapted for use with aluminum or glass substrates.
LaRont: So, is this for PCBs and some semiconductor packaging technology as well?
Okamoto: This is very fortunate because after we developed it for PCB manufacturing, we found that our printer, our ink, can print over glass, aluminum, or ceramics. Many customers are asking us, "Can you print on ceramic?” or "Can you print on glass?” because they are looking for many things, not just for the PCB. They are especially looking for semiconductor packaging or other applications. We are expanding our target customers and trying to solve the various customer requirements.
LaRont: What is the difference between copper, aluminum, and ceramic glass? Is there trouble with adhesion?
Okamoto: For the moment, the whole material complies with IPC standards. As I mentioned, we are trying to make electronics sustainable; that's why we are providing the solutions. We can develop different solutions for other requirements. This may include a different ink, printer, or primer.
LaRont: If a customer has a request, you want to partner with them to create a solution?
Okamoto: Yes, but we are a very small company, so we would like a real partner. For my part, I would appreciate some testing or something similar. It can be quite challenging, but if businesses are facing issues and would like to resolve them using our technology, we are always open to collaboration.
LaRont: That's really important. If you want to add value in electronics manufacturing today, you really have to be in that space where you'll partner with your customers on NPI and such.
Okamoto: Until today, it's been quite difficult because our biggest advantage is sustainability. Everybody says that sustainability is very important, but it's really tough to make decisions, especially in the FPC and PCB areas. We have already established a net-zero target internally, and the European side is expressing concerns about this. This is a good time to consider implementing this manufacturing method, which typically takes two to three years. It’s an excellent opportunity to aim for a target year of 2030 or 2035.
LaRont: I agree that everybody's talking about it but having trouble doing it. If you know anything about inkjet technology, you know there's a lot less waste and so much less copper. What are the sustainability benefits of your technology?
Okamoto: We don't have any washing and etching process so we can reduce water consumption by 95%. No etching means fewer chemical contaminants. As a result, we can reduce 75% CO2 emissions.
LaRont: That's quite a lot of green right there.
Okamoto: Also, many people consider green technology expensive, but copper and water are very expensive resources now. With our technology, you can reduce copper by 70%, so your manufacturing costs should be lower.
LaRont: We're approaching the point where it will be just as costly not to do it.
Okamoto: The advantage of our technology is we use 100% of the copper ink and the copper plating, so it can be possible to directly replace what our customers are using now. There's no compromise.
LaRont: Requalification is one thing, but there’s no need to redesign?
Okamoto: No need to redesign.
LaRont: Nobu, it sounds like exciting technology. Hopefully we'll hear more about it in the future.
Okamoto: Thank you very much.
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.