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LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
April 24, 2025 | LITEON TechnologyEstimated reading time: 1 minute
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Building upon their initial collaboration in 2023, which focused on developing low-carbon Flexible Printed Circuits (FPC) technology for commercial applications, this new agreement expands the scope to include equipment investment with integration into existing production lines in cooperative factories. The adoption of Elephantech’s proprietary technology will help inject new momentum into building a more sustainable supply chain.
Roger Chen, Director of LITEON+, the company's startup platform, stated: "The signing of our second MoU marks a new milestone in our partnership with Elephantech. We're moving beyond early-stage product applications in equipment investment. Through this advancement, we will be able to embed sustainability deeper into our operations and continue leading the industry in building sustainable competitiveness."
Since its establishment in 2023, LITEON+ has been dedicated to nurturing promising global startups that share a vision for sustainability. The platform provides resources, technology and accesses to international market expansion. Elephantech, as one of LITEON+'s first strategic partners, has been instrumental in developing innovative applications for low-carbon PCB technology.
Elephantech's agile startup model has rapidly accelerated new technology implementation. In just six months, both companies have successfully validated the feasibility of applying Elephantech’s technology to multilayer PCBs. Under this new MoU, LITEON plans to invest in Elephantech's proprietary PCB manufacturing equipment and implement it into existing cooperative factories to comprehensively upgrade production lines. This collaboration will help to reduce the carbon footprint of consumer electronics production, cut water and copper consumption, minimize environmental impact—ultimately enhancing sustainability throughout the supply chain and setting a new benchmark for green manufacturing.
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Sweeney Ng - CEE PCBSuggested Items
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.
TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging
10/02/2025 | Texas InstrumentsTexas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date.
Rigetti, in Collaboration with QphoX, Awarded $5.8M AFRL Contract to Advance Superconducting Quantum Networking
09/29/2025 | RigettiRigetti Computing, Inc., a pioneer in hybrid quantum-classical computing, announced that it was awarded a three-year, $5.8 million contract from the Air Force Research Laboratory (AFRL) to advance superconducting quantum networking.
High-Tech Hill Technology Park Opens: Four New Factories Launched
09/26/2025 | TeltonikaThe ambitious vision announced in late 2020 to build a world-class technology park in Liepkalnis, Vilnius, has become a reality. AGP Investments, led by entrepreneur Arvydas Paukštys, together with high-tech leaders Teltonika and TLT, today inaugurated four new factories at the Vilnius High-Tech Hill Technology Park.
LPKF to Unveil CuttingMaster 2240 Cx at Productronica
09/26/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics SE will be showcasing the CuttingMaster 2240 Cx as part of the Fraunhofer IZM production line at this year's Productronica in Munich, demonstrating state-of-the-art laser technology in action.