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August 11, 2025 | AtotechEstimated reading time: 2 minutes
MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS will spotlight its strategic brands, Atotech and ESI, while unveiling the latest breakthroughs in PCB and package substrate manufacturing. Visitors to the IPCA booth (H11-A7) can explore a comprehensive portfolio of advanced solutions, including chemical processes, precision production systems, auxiliary equipment, lasers, software, and service – all designed to work in harmony and to maximize production yield, reliability, and efficiency, helping manufacturers achieve superior results.
Leveraging its expertise across lasers, optics, motion, process chemistry, and equipment, MKS is pioneering next-generation interconnect solutions to meet the demands of miniaturization and complexity in advanced electronics. The company’s Optimize the InterconnectSM philosophy reflects its unmatched ability to enable innovation, empowering customers and partners with integrated, cutting-edge solutions for advanced PCB and package substrate manufacturing. By combining MKS’ ESI industry-leading laser drilling technologies with MKS’ Atotech chemistry and plating systems, the company is setting new benchmarks for precision, performance, and scalability – key to enabling next-generation technologies with finer features.
At booth H12.N01 product experts will be available and introducing the following chemistry highlights this year:
ViaKing®: enhanced graphite-based direct metallization process offering high reliability, low cost of ownership, and excellent stability for both high and low volume production.
Noviganth® AF: provides superior cleaning, conditioning, and stable copper deposition for rigid, flex, and flex-rigid PCB production
Cupracid® AC5 DR series: provides a solution for conformal copper plating with soluble anodes, with an operational high current density of up to 3 A/dm². The high throwing power allows for reduction in copper consumption and minimises overall production costs.
OS-Tech® SIT 2: organic surface finish offers a solderable, eco-friendly option for electronics, ensuring multiple reflow cycles and compatibility with Atotech’s ENIG processes, with coating thickness as a key quality control measure.
Stannatech® 2001: provides reliable, high-quality, and cost-efficient tin plating with excellent whisker control and solder joint integrity, trusted by HDI, automotive, and package substrate customers globally.
CupraEtch® SR 8000: cost-effective, cupric chloride-based microetching system that enhances dryfilm and soldermask adhesion through a simple three-step process, offering uniform surface roughening and easy integration into existing lines.
Equipment highlights include:
Uniplate® PLBCu6: Energy-efficient horizontal solution for producing reliable fine-line interconnects with superior copper plating performance and minimized handling requirements.
Geode™ G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing.
CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%.
A spotlight is also set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components.
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