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Cadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.

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DOCOMO, NEC Launch Japan's First Commercial 5G Core on AWS

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DesignCon 2026: From Copper to Quantum to Agentic AI

02/26/2026 | Kelly Dack, I-Connect007
Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design

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ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million.
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