-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Mr. Laminate Tells All: Where in the Holy Halogens did 900, 900, 1500 Come From?
November 12, 2015 | Doug Sober, Essex Technologies GroupEstimated reading time: 4 minutes
This new column, to appear monthly at PCB007, will focus on base materials and the laminate industry.
The 900, 900, 1500 is not a combination to an enormous safe that contains the remains of Jimmy Hoffa, nor is it the weight of three elephants at the San Diego Zoo in kilograms. The 900, 900, 1500 is the maximum parts per million (ppm) of bromine and chlorine and the total bromine and chlorine in a material that can be defined as “halogen-free” in the electronics industry today. But where did these requirements come from? Clearly, 900 ppm of bromine or chlorine is obviously not halogen-free. Some would argue that it is not even low-halogen at all.
In 2001, during an International Electrotechnical Commission (IEC, Geneva CH) meeting of TC91 Working Group 4: Base Materials and Boards, the member countries decided there should be a specification for FR-4 copper-clad laminates that were halogen-free. Several Japanese manufacturers were selling these laminates and prepregs around the world, primarily in Europe, but there were no specifications to conduct commercial business. Although the square meters per month of sales were quite small at the time, we knew that this product line would grow.
IEC 61249-2-21 was the document number designated in becoming the first FR-4 halogen-free standard in the world. The Working Group 4 decided to base the document and the requirements on the brominated counterpart IEC-61249-2-7 in terms of other property requirements. The main change was a relaxed moisture absorption requirement since halogen-free resins were worse than their brominated counterparts in these tests.
This was the easy part, but defining the halogen content would prove to be more controversial. During subsequent meetings, the Japanese National Committee, led by Dr. Aki Shibata, proposed a maximum of about 450 ppm of chlorine and about 450 ppm of bromine as a specification limit. As the USA National Committee leader, I proposed 1200 ppm for both halogens, as several domestic resin companies presented data that this was a more reasonable number. The debate continued for more than one year. No punches were thrown, but there was still a lot of pain.
One problem was that the copper-clad laminates (CCL), comprised of a higher resin content, generated a higher test value, since all the chlorine and bromine contaminants were coming from the epoxy resin components. For example, a 0.10 or 0.20 mm thick CCL may have a resin content of more than 65% while a 1.52 mm thick CCL may have only 40% resin. So two CCLs using the same resin varnish, but different constructions, generated significantly different results in the halogen test. In the end, the test specimen was defined as eight plies of low resin content/fiberglass fabric construction.
With the test specimen defined, the compromise on the definition of halogen-free between Dr. Shibata and me was decided upon as 900 ppm maximum chlorine, 900 ppm maximum bromine and a new requirement of 1500 ppm maximum for chlorine plus bromine. The rest of the Working Group 4 members agreed to these proposed specifications and the document was completed using the IEC process scheme for developing standards with a vote of the member countries.
Page 1 of 2
Suggested Items
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.