Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Ventec International Appoints Denis McCarthy Jr. as Technical Sales Account Manager
September 27, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International is delighted to announce the appointment of Denis McCarthy Jr. as Technical Sales Account Manager based at the company’s Chicago facility.
Driven by Ventec's wide-spread growth, the company is expanding its sales force and adding more technical sales expertise. To help the company develop its presence in the Northeast United States, Denis McCarthy Jr. will be responsible for business development activities in the Chicago East Territory selling and supporting all product lines. With his particular knowledge in IMS material/metal core PCB and flex materials/rigid flex PCB, Denis will also play a key role in driving forward the company’s IMS material ranges and Ventec’s latest Thinflex line and No-Flow/Low-Flow prepregs.
Having previously worked as Operations and Quality Manager at Ventec’s Chicago facility, Denis re-joins the company with over 25 years of focused industry experience and an in-depth understanding of customer requirements. Denis began his career at Sanmina Corp before moving on to production supervision and management roles at Printed Circuit Corp., Telcom USA Inc. and Time Sensitive Circuits. Most recently, Denis held the position of Engineering Manager at H and T Global Circuits with overall responsibility for process engineering.
“Denis has an excellent reputation and industry network in the region and we’re thrilled to bring him on board again as Ventec expands,” said Jack Pattie, President of Ventec USA.
For more information about Ventec’s solutions and the company’s wide variety of products, please click here and/or download the Ventec APP.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry.
Share on:
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.