Raytheon Developing Next-gen Human/Machine Interface for Armored Ground Vehicles
October 10, 2016 | PRNewswireEstimated reading time: 1 minute
Raytheon Company is developing new technology to provide comprehensive situational awareness to troops inside windowless armored vehicles, as part of the Defense Advanced Research Projects Agency (DARPA)'s Ground X-Vehicle Technologies (GXV-T) program.
The goal of GXV-T is to improve the mobility and survivability of armored vehicles without adding more armor and weight. DARPA is funding advanced technology development in four related areas: mobility enhancement, agility for survivability, crew augmentation and signature management. Raytheon BBN Technologies is developing crew-augmenting technologies.
"Our team is developing a virtual experience that gives the crews of armored military vehicles greater awareness of what's going on outside the vehicle, while also reducing their vulnerability to attack," said David Diller, GXV-T program manager for Raytheon BBN. "We're creating a three-dimensional model of the environment in real time that gives users views of their outside environment that would not normally be possible from inside the vehicle."
The Raytheon BBN technology uses lidar data to create a 3D model of the environment, employing high-definition video to produce a detailed, natural rendering of the surroundings. Additional sensors provide the precise location of any incoming hostile fire, while blue-force position updates locate friendly forces. Presenting all this sensor data in a natural, intuitive interface improves situational awareness while reducing the workload for the crew and allowing them to focus on the most relevant threats and challenges.
Raytheon BBN Technologies is a wholly owned subsidiary of Raytheon Company.
About Raytheon
Raytheon Company, with 2015 sales of $23 billion and 61,000 employees, is a technology and innovation leader specializing in defense, civil government and cybersecurity solutions. With a history of innovation spanning 94 years, Raytheon provides state-of-the-art electronics, mission systems integration, C5I™ products and services, sensing, effects, and mission support for customers in more than 80 countries.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.