New 3D Design for Mobile Microbatteries
October 12, 2016 | CNRSEstimated reading time: 2 minutes
In the race towards miniaturization, a French-US team-mostly involving researchers from the CNRS, Université de Lille, Université de Nantes and Argonne National Laboratory (US) as part of the Research Network on Electrochemical Energy Storage (RS2E)1-has succeeded in improving the energy density of a rechargeable battery without increasing its size (limited to a few square millimeters in mobile sensors).
This feat was achieved by developing a 3D structure made of microtubes, the first step towards producing a complete microbattery. The first experiments have demonstrated the excellent conductivity of the battery's solid electrolyte, whose highly encouraging performance is published in the journal Advanced Energy Materials on October 11, 2016 ("Atomic layer deposition of functional layers for on Chip 3D Li-ion all solid state microbattery").
A: 3D scaffold of the microbattery machined in a silicon substrate to form double microtubes. B: schematic of a 3D Li-ion microbattery showing the stacking of materials deposited in thin layers using ALD. C: Transmission electron microscopy analysis of thin film coatings.
In the era of connected devices, intelligent connected microsensors require miniature embedded energy sources with great energy density. For ultra-thin-or planar-microbatteries, increased energy density means using thicker layers of materials, which has obvious limitations.
A second method-used by the authors of the publication-consists in machining a silicon wafer2 and producing an original 3D structure made of simple or double microtubes. 3D batteries keep their 1mm2 footprint area, but develop a specific area of 50 mm2-an enhancement factor of 50! These robust microtubes are large enough (of the order of the micron) to be coated with multiple layers of functional materials3.
Images of double microtubes obtained by scanning electron microscopy. (Image: Christophe Lethien)
The main technological challenge consisted precisely in depositing the different materials that make up the rechargeable battery in thin and regular layers on these complex 3D structures. Using the cutting edge technology of Atomic Layer Deposition (ALD), the materials perfectly took on the 3D shape of the template without blocking the tube structures.
In this way the researchers created an insulating thin film, a current collector, a negative electrode, and a solid electrolyte. The various analyses and characterizations (synchrotron X-ray nanotomography and transmission electron microscopy4) show that the successive layers are of excellent quality, showing conformality of nearly 100%. The interfaces are clean (no interdiffusion between the different chemical elements), with no pinholes, cracks, or fissures detected.
Synchrotron X-Ray Tomographic analysis of one microstructure covered with multiple layers of materials. (Image: Arnaud Demortière / Vincent De Andrade)
Lithium phosphate, the electrolyte of this future 3D microbattery, is in solid form5. After depositing it using the same ALD technology, researchers showed that it has a high electrochemical stability window (4.2 V), high ionic conductivity, and low thickness (10 to 50 nm), which generates low surface resistance, all of which are very encouraging for the future performance of the 3D battery.
The next step will consist in using ALD to develop thin films of positive electrode materials in order to create the first functional 3D prototypes, which will certainly offer much greater performance than today's planar microbatteries.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.