Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs
November 16, 2016 | IPCEstimated reading time: 2 minutes
The latest technical research, industry best practices, trending topics, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO 2017 technical conference and professional development courses, which will take place February 11–16 at the San Diego Convention Center in San Diego, California. Registration is now open here.
In keeping with the event’s theme, “Technology’s Turning Point,” the technical conference will feature approximately 90 technical papers detailing original research and innovations from industry experts around the world. Subject-matter experts will cover topics in the areas of board fabrication and design, electronics assembly and test.
Attendees wanting to learn more about best practices in design, lead-free technologies, materials, process improvement, solder joint reliability, PCB fabrication and materials, quality and reliability and more, can choose from 34 professional development courses that go beyond theory to address real-world problems and provide practical solutions that could be implemented immediately for real-world success.
“Our technical conference is at the heart of technology's turning point. The content, including the latest original research, will set the stage for the electronics industry innovation that will turn our industry toward the future,” said IPC Technical Conference Director Jasbir Bath. He adds, “Our wide-ranging educational program features a variety of learning opportunities where attendees can access the latest research and development in the industry and learn more about trending materials, applications and processes such as printed electronics. Attendees can take everything they learn back to their company and put it all to work.”
In addition, IPC APEX EXPO features many free activities, including technical BUZZ sessions, poster presentations, keynotes on “The Big Bang Theory - Making Science Cool (and Funny)” by actress, author and neuroscientist Mayim Bialik and “The Future of Drones” by Naval officer, military pilot and Duke University professor, Mary Cummings. The highly popular New Products Corridor and the new Printed Electronics Pavilion will be featured along with more than 450 of the industry’s top suppliers.
Access to the exhibit hall is free to those who register in advance, a savings of $40 on-site. Attendees who register by January 12, 2017, will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will save a significant percentage off a la carte options.
More information about IPC APEX EXPO 2017, including details on education and technology, network opportunities, show floor activities, schedule, travel and more is available here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.