Super-Flexible Liquid Crystal Device for Bendable and Rollable Displays
December 14, 2016 | Tohoku UniversityEstimated reading time: 2 minutes

Researchers at Tohoku University have developed a super flexible liquid crystal (LC) device, in which two ultra-thin plastic substrates are firmly bonded by polymer wall spacers.
The team, led by Professor Hideo Fujikake and Associate Professor Takahiro Ishinabe of the School of Engineering, hopes the new organic materials will help make electronic displays and devices more flexible, increasing their portability and all round versatility. New usage concepts with flexibility and high quality display could offer endless possibilities in near-future information services.
Previous attempts to create a flexible display using an organic light-emitting diode (OLED) device with a thin plastic substrate were said to be promising, but unstable. The plastic substrates are poor gas-barriers for oxygen and water vapor, and the OLED materials can seriously be damaged by their gasses. As for flexible OLEDs, there has also been no device fabrication technology established so far for large-area, high-resolution and low-cost displays.
To overcome these challenges, Fujikake's research team decided to try making existing LC displays flexible by replacing the conventional thick glass substrates, which are both rigid and heavy, with the plastic substrates, because LC materials do not deteriorate even for poor gas barrier of flexible substrates.
Flexible LC displays have many advantages, such as established production methods for large-area displays. The material itself, which is inexpensive, can be mass produced and shows little quality degradation over time.
However, in conventional flexible LC displays, one important problem remains. The gap of plastic substrates (100 μm thick) sandwiching an LC layer becomes non-uniformed when the LC device is bent, causing the display image to be distorted.
In their study, Fujikake's team developed a super-flexible LC device by bonding two ultra-thin transparent polyimide substrates (10 μm thick approximately) together, using robust polymer wall spacers.
The ultra-thin transparent substrate is made using the coating and debonding processes of a polyimide solution supplied by Mitsui Chemicals. The result is a flexible sheet, similar to food-wrapping cling film.
The substrate has the attractive features of heat resistance, and the ability to form fine pixel structures, including transparent electrodes and colour filters. The refractive index anisotropy is extremely small, making wide viewing angles and high contrast ratio possible.
The polymer wall spacers bonding substrates are formed by irradiating a twisted-alignment LC layer including monomer component with patterned ultra-violet light through single thin substrate. While the substrate gap is more variable as the substrate thickness is decreased, the stabilization of ultra-thin substrates becomes possible by small pitch polymer walls.
The research team also demonstrated that the device uniformity is kept without breaking spacers even after a roll-up test to a curvature radius of 3mm for rollable and foldable applications.
The above research results show that LC displays with large-area, high-resolution and excellent stability can be as flexible as OLED displays. The super-flexible LC technology is applicable to mobile information terminals, wearable devices, in-vehicle displays and large digital signage.
Moving forward, the team plans to form image pixels and soften the peripheral components of polarizing films, and a thin light-guide sheet for backlight.
Part of the results of this research was first announced at the International Symposium on Society for Information Display held in San Francisco, USA, in May, 2016.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Printed Electronics Market Size to Top $83.77 Billion by 2034 Driven by IoT Adoption and Flexible Device Demand
09/11/2025 | Globe NewswireThe printed electronics market size has been calculated at U$19,920 million in 2025 and is expected to grow from $23,58 million in 2026 to approximately $83,770 million by 2034.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.