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LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory

05/01/2025 | PR Newswire
LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.

Pioneering the Future of Substrate Manufacturing for North America

04/07/2025 | Marcy LaRont, I-Connect007
In a rapidly evolving manufacturing landscape, the shift toward substrate technology has become a focal point for some companies in the PCB industry. Ralph Jacobo, technical sales and application engineer at all4-PCB, says all4-PCB has its roots in via-filling technology, has successfully navigated various market changes, and is now keenly focused on the demands of substrate manufacturing in North America. Ralph shares insights into the company's historical journey, current initiatives, and the innovative steps being taken to address the complexities of modern substrate processes.

MKS’ Atotech and ESI Participate in CPCA Show 2025

03/25/2025 | Atotech
MKS Instruments, Inc., a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (laser systems) and Atotech (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at CPCA Show being held at National Exhibition and Convention Center from March 24-26, 2025.

Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai

03/24/2025 | DuPont
DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.

INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation

03/11/2025 | iNEMI
The fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.
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