Investing in Digital Innovation
December 30, 2016 | HSBCEstimated reading time: 1 minute
SBC is working with the Hong Kong government to develop the next generation of banking technology at a new digital innovation lab.
The bank and the government-funded Hong Kong Applied Science and Technology Research Institute (ASTRI) have joined together to focus on areas including online banking, cyber security, biometric authentication, big data analytics, artificial intelligence and blockchain technology at the lab in Hong Kong.
HSBC has adopted an artificial intelligence system for reading Chinese characters developed by ASTRI. The system has been trained to recognise millions of different versions of characters, including traditional and modern script, and continuously learns to improve its accuracy. Applying this technology is enabling the bank to reduce the time taken to enter basic customer information such as addresses.
Darryl West, Global Chief Information Officer, HSBC, said: “Banks must continue to embrace new technologies to be able to create the types of banking our customers expect. That is why HSBC is investing and creating partnerships to drive innovation.”
ASTRI was founded in 2000 by the Hong Kong SAR government with a mission to improve the territory’s competitiveness in technology-based industries. Developing technology for the financial sector is seen as crucial to maintaining Hong Kong’s status as a global financial hub.
HSBC works with dozens of technology companies and research institutions around the world to advance its own digital capabilities.
In June this year, for example, HSBC invested in Tradeshift, a leading financial technology company that connects buyers and suppliers around the world. In August a consortium including HSBC announced a proof of concept showing how blockchain technology could be used to improve paper-based processes at the heart of trade. And in October the bank signed a five-year agreement with The Alan Turing Institute, the UK’s newly created national centre for data science, to work with the institute’s scientists using big data analytics to better understand economic trends.
HSBC aims to help the next generation of digital experts by mentoring and investing in start-ups and supporting talented young students. Since 2011, HSBC has sponsored an innovation and technology scholarship together with the Hong Kong government’s Innovation and Technology Commission.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.