Scientists to Develop Liquid Antennas
January 17, 2017 | University of LiverpoolEstimated reading time: 2 minutes

University of Liverpool researchers have been awarded £578k funding from the Engineering and Physical Sciences Research Council (EPSRC) to develop liquid antennas which have the potential to transform modern radio communications and radar.
Antennas convert radio waves into electrical signals and are an essential component in mobile and wireless products from smart phones to radar. Traditionally antenna are made out of materials such as copper which although have good conductive properties are hard to reconfigure with limited bandwidth, as well as being large, heavy and expensive.
As the `Internet of Things’ and 5G become more of a reality, there is a need to develop a new type of antenna which is small, transparent and has better reconfigurability than conventional metal antennas.
It is known that water can be used as an antenna and has potential to overcome many of the problems facing traditional metal antenna. However, water becomes ice once the temperature goes below 0 degree C.
This research project will bring together radio engineering experts from the Department of Electrical Engineering & Electronics (Professor Huang’s team) with Material Scientists in the Department of Chemistry (Professor Xiao’s team), to identify the most suitable liquid materials which can be used as antenna.
The liquids will be tested for low loss, thermal and mechanical stability, whether they can work in temperatures ranging from -30 to +60 degree C, if they transmit the correct frequency range (from kHz to GHz) and have Radio Frequency and microwave power range up to 100 kW.
The project will also investigate how to design and make compact and efficient liquid antennas which are flexible or reconfigurable in terms of the main antenna parameters (such as the operational frequency, radiation pattern, and size) and suitable for a wide range of real world applications.
Professor Yi Huang, an international expert in radio engineering who is leading the research, said: “This original and transformative approach is able to meet the demands of the next generation of mobile devices, and the opportunities afforded by the `Internet of Things’.
“This research project aims to go one step towards developing a novel type of antenna by bringing together new knowledge in material science with radio engineering expertise in order to provide an alternative compact reconfigurable and/or flexible device to the wireless world and meet the demands from the telecommunications industry.”
The research is funded by the EPSRC and also involves industrial partners BAE Systems and Huawei.
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.