-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Royal Circuits Invests in Additional HASL Machines from New Technology Overman
January 25, 2017 | Royal Circuit SolutionsEstimated reading time: 2 minutes

California-based circuit board manufacturer, Royal Circuits has purchased and successfully installed their second new hot air solder leveling machine from New Technology Overman (NTO) and have placed an order for a third machine to be delivered in February of this year. The new machine allows Royal Circuits to now process both tin/lead and lead free HASL in house.
The NTO HASL machines are said to be the most precise vertical HASL machines made. It utilizes a variable speed linear unit with drive motor for the arm movement and a separate heat exchanger, both controlled by the PLC. NTO has always supplied their machines with titanium clamps and air knifes for the best possible finish available with no solder sticking to either, as well as a robust pumping system with a variable speed that will go into standby mode when not in operation, thus saving the solder life. These machines were ordered with the remote access modem so the factory can see in real time and, if requested, any issues they may have. This also allows for any needed software upgrades.
Milan Shah, President of Royal Circuits states, "We wanted to offer our customers the ability to do all processes in house and the NTO Model 2424LF HASL machine will help us do that. The NTO HASL units have proven to be reliable precision machines with easy maintenance and superior quality surface finish."
About Royal Circuit Solutions
Headquartered in Hollister, California, Royal Circuit Solutions is a one stop shop for PCB projects from design to assembly as well as unsurpassed technical support and customer service for accounts across the U.S. and around the world. The company specializes in advanced technology (blind via, buried via, epoxy via fills, controlled impedance etc) PCB manufacture. Its core quick-turn capability is utilized for development of prototypes (PCBs) and medium production runs, over a time horizon, which stretches from 24 hours to several weeks with normal lead times of 1 to 10 days. Royal’s dedicated and knowledgeable staff combined with the cutting edge equipment ensures customer success. For more information, click here.
About New Technology Overman (NTO)
Netherlands-based New Technology Overman specializes in designing, developing, drawing and manufacturing of mechanical parts, machines, and equipment for surface treatment processes in the PCB industry, specializing in HASL machines and automatic or manual vertical plating lines.
NTO strives to be a substantial and reliable service provider in mechanical engineering, services, machines, and parts. For more detailed information, contact David Dye of Quick Turn Inc. at 479-466-6586.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.