Nano Smart Sensors Emerge as Key Enablers of Evolving Homeland Security
January 26, 2017 | Frost & SullivanEstimated reading time: 1 minute

Rising instances of international terrorist threats against citizens and critical infrastructures are intensifying investment in security measures and sophisticated sensing technologies. Early detection systems for dangerous materials and compounds are critical for timely control and reaction strategies.
“Sensors are being developed specifically for security personnel at border checkpoints and airports to help detect low volumes of gas emanating from explosive materials,” said Frost & Sullivan TechVision Consulting Analyst Ugo Feracci. “Detecting triacetone triperoxide (TATP) explosives used by suicide bombers, hidden or packaged chemical materials, and intentional damage or changes to critical infrastructure are a few of the emerging areas for smart sensors application. The willingness to equip privates and security personals with these individual, small, and advanced detectors will be one of the game changers. ”
Advanced Sensor Technologies for Homeland Security is part of TechVision (Sensors & Control) Growth Partnership Service programme. The insight reveals that synchronizing different types of sensors to achieve a timely output for action plans is a key challenge. Integrating the time aspect or 4D will enable sensors to move beyond classic detection capabilities. This research explores growth opportunities in homeland security for different sensing technologies, including chemical, biological, radiological, nuclear and explosives (CBRNE) sensors, and terahertz, infrared, acoustic, spectrometric as well as nano sensors.
Click here for complimentary access to more information on this analysis and to register for a Growth Strategy Dialogue, a free interactive briefing with Frost & Sullivan’s thought leaders.
“Nano sensors will emerge a winner in the security landscape in the next five years,” observed Feracci. “By 2020, sensors will be able to detect low levels of dangerous materials. Eventually, CBRNE sensors can be a standard tool on every policeman’s belt to help detect drugs or assess certain risks.”
However, commercializing these technologies may be difficult, for two main reasons: research and development is really expensive in this area and the commercialization depends on governments’ willingness to invest in new technologies to equip its security forces. Further, local players, spin-offs and start-ups can disrupt the market by providing alternative, cost-competitive solutions to individuals, without the government’s involvement up to a certain extent.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.