Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Nano Dimension Combines Electronic Components within PCBs as part of the Printing Process
January 30, 2017 | Nano Dimension Ltd.Estimated reading time: 1 minute
Nano Dimension Ltd., a leader in the field of 3D printed electronics, announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has successfully 3D printed electrical circuits, in which it embedded electrical components, through placement, as an integral part of the printing process. The company's 3D printer - the DragonFly 2020 - enables 3D printing of PCBs with conductive ink and dielectric ink.
Today, the company announced a successful proof of concept of PCBs inkjet printing, in which electrical components were placed during the printing process. The method presents several advantages:
- It improves the PCB reliability by maintaining the electronic components internally and keeping them from being exposed to the external environment, while protecting them from mechanical, temperature, and corrosion damages.
- It makes obsolete the soldering process since the components are embedded within the printed board during printing. The connectivity between components then takes place as part of the 3D printing process without the need for a mediating soldering material.
- The new process enables printing on electronics components without their complete packaging (printing directly on the dye), and consequently supports the creation of thinner, more protected PCBs.
This new and significant capability is expected to become supported in future versions of Nano Dimension's 3D printers.
The company has filed a patent application with the U.S. Patent and Trademark Office for this unique development, which the company believes is significant for a wide range of industry sectors such as defense, space, consumer products, telco, and more.
About Nano Dimension Ltd.
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems and advanced additive manufacturing. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software, and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards), and advanced nanotechnology-based conductive and dielectric inks.
In addition to the trading of the company's American Depositary Shares on NASDAQ, the company's ordinary shares are also traded on the TASE in Israel. The Bank of New York Mellon serves as the depositary for Nano Dimension.
Share on:
Suggested Items
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
05/27/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its through-hole technology (THT) assembly processes.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.