Meyer Burger to Showcase Solder Resist Printing at IPC APEX EXPO
February 7, 2017 | Meyer BurgerEstimated reading time: 1 minute
Meyer Burger (Netherlands) is exhibiting at the IPC APEX EXPO show in San Diego, CA (February 14−16) and will present our inkjet printing equipment and technology for solder mask and printed electronics applications.
Meyer Burger invites you to visit us at booth 1125 in the Flexible and Hybrid Electronics pavilion and learn about our innovative technology and equipment for additive manufacturing based on drop-on-demand, digital inkjet printing. We will showcase:
- PCB solder resist printing
- Printed, flexible and hybrid electronics
Both are emerging technologies in the electronics manufacturing industry. We look forward to explaining to you about the benefits and technological advancements, the materials, and our production equipment.
You will also find our R&D equipment on display at the booth of Insulectro (#3733/3833).
About Meyer Burger
Meyer Burger is a leading global technology company specialising in innovative systems and processes for manufacturing of electronics. The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the PCB, semiconductor and the optoelectronic industries as well as other selected high-end markets based on electronics materials.
The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. To learn more, click here.
About PiXDRO
With its PiXDRO inkjet technology, Meyer Burger is leading in the field of functional inkjet printing.
PiXDRO JETx printers are equipped with piezoelectric, drop-on-demand inkjet technology and are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, PCB, OLEDs, sensors, semiconductors, MEMS, chemical machining, 3D printing, photovoltaics, life science, and optics.
The PiXDRO product offering includes JETx production equipment, research and development tools, process support, training and service and is complemented by a strong network and knowledge base in inkjet materials and head technology.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.