Global Solder Flux Market: Increasing Production of PCBs to Reflect Positively on Sales
February 21, 2017 | Transparency Market ResearchEstimated reading time: 2 minutes

According to a new research study by Transparency Market Research (TMR), the rivalry between Johnson Matthey, Henkel AG & Co. KgaA, Heraeus Holding, and Kester define the competitive landscape of the global market for solder flux. A large number of established players with state-of-art technical capabilities operate in this highly fragmented market.
These players mostly benefit from their experience as they have gained proficiency in producing solder flux for electrical and electronic equipment. Going forward, they would engage more in mergers, acquisitions, and partnerships, which is likely to curtail the competition within this market a little in the near future, notes the study.
TMR estimates the global market for solder flux offered an opportunity worth US$213.2 mn in 2015. Rising at a CAGR of 6.30% during the period from 2016 to 2024, the value of this market is likely to touch US$367.3 mn by the end of the forecast period. The demand for solder flux has been exceptionally high from ball grid arrays (BGAs) and the scenario is expected to remain same over the forthcoming years.
Rise in Automotive and Consumer Electronics Sectors to Ensure Dominance of Asia Pacific
The research report also presents a geographical assessment of the worldwide market for solder flux, according to which, the global market is spread across Latin America, Europe, Asia Pacific, North America, and the Middle East and Africa. Currently, Asia Pacific holds the topmost position in this market, thanks to the fast developing consumer electronics and automotive industries. Asia Pacific accounted for a share of more than 60% in the global shipment volume of solder flux in 2015.
With the steady growth of the printed circuit board (PCB) and the semiconductor industries, China has emerged as the key domestic market for solder flux in Asia Pacific and is likely to retain its position over the period of forecast. India is also expected to witness a steady rise in its market for solder flux in the near future, thanks to the increasing number of government initiatives, especially the “Make in India” project. The strengthening economic conditions in China, India, and other Asian countries are projected to support the Asia Pacific solder flux market substantially during the forecast period.
On the flip side, North America and Europe, which collectively, held a prominent share in the global market for solder flux previously, are likely to experience moderate declining due to the maturing state of the North American market and the economic instability in Europe over the next few years, states the research report.
Rising Demand for Computers and Mobile Phones to Boost Application of Solder Flux in PCBs
“As a widespread range of solder flux products of various grades are employed in printed circuit boards (PCBs), the increasing production of PCBs, boosted by the augmenting demand for computers and mobile phones, will reflect positively on the sales of solder flux across the world over the forecast period,” says the author of this report.
Apart from this, the rise of the automotive and the semiconductor markets in the world, especially in the emerging economies, is also anticipated to boost the growth of this market in the near future. However, the easy availability of PCB design software may create obstacles in the growth trajectory of this market over the years to come, reports the study.
Suggested Items
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.