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Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability

07/10/2025 | Microchip
Continuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.

OSI Systems Lands $17 Million Order for Cargo and Vehicle Inspection Systems

07/07/2025 | BUSINESS WIRE
OSI Systems, Inc. announced that its Security division received an order valued at approximately $17 million from an international customer for cargo and vehicle inspection systems.

KYOCERA AVX Releases New 3DB Hybrid Couplers

07/04/2025 | PRNewswire
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.

Accenture Acquires SYSTEMA to Drive Manufacturing Automation for Semiconductor Clients

07/02/2025 | Accenture
Accenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany.

Driving Innovation: Direct Imaging vs. Conventional Exposure

07/01/2025 | Simon Khesin -- Column: Driving Innovation
My first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
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