Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

What Climate Week NYC Conversations Mean for the Electronics Industry

10/09/2026 | Kelly Scanlon and Seth Jacobsen, Global Electronics Association
Climate Week NYC brought together plenty of big ideas, but the conversations that stayed with us were grounded in everyday business realities. Companies are thinking about sustainability in terms of what it means for their ability to manage risk, keep costs in check, secure materials and energy, and remain competitive. That is particularly relevant for electronics. Our industry relies on global supply chains, specialized materials, dependable infrastructure, and skilled people. As demand for AI, computing capacity, and new technologies grows, so does the pressure on all those systems.

Koh Young to Unveil AI Inspection Solutions at NEPCON Asia 2026

10/07/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON Asia 2026, October 27–29 at the Shenzhen World Exhibition & Convention Center in Shenzhen.

Global Robotaxi Fleet to Exceed 1.5 Million Vehicles in 2036

10/06/2026 | Berg Insight
The emerging robotaxi market is one of the most dynamic segments of the automotive industry. Berg Insight expects that the number of robotaxis will reach 1.53 million vehicles in 2036. This represents a massive growth from 6,500 robotaxis operating worldwide at the end of 2025.

I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next

10/07/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part podcast series. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.

SAIC Acquires Information Security Corp., Expands Zero-Trust and Encryption Capabilities

10/05/2026 | SAIC
Science Applications International Corp., a leading mission integrator supporting defense, space, intelligence, and civilian agencies, announced it has completed the acquisition of Information Security Corporation (ISC).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in