Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Lenthor Engineering Announces Year End 2016 Financial Results
March 29, 2017 | Lenthor EngineeringEstimated reading time: Less than a minute
Lenthor Engineering, a California based designer, manufacturer and assembler of RIGID-FLEX and FLEX printed circuit boards, announces its 2016 year end financial results.
Total revenue for the full year 2016 came in at $27.1M compared to $19.9M in 2015 a 37% increase. Strong performance was reported for Q4 2016 with revenue totaling $6.4M compared to Q4 2015 results of $6.2M representing a 3% increase. Profit totals for both Q4 2016 and full year 2016 also reported in as strong reflected full year revenue results.
Lenthor Engineering continues funding of its business expansion plans with capital expenditures in 2017 planned for $2.2M. As part of that plan Lenthor has expended $1M to date in its Assembly and Fabrication area. The expenditures in Assembly which include both Solder Paste AOI and Component AOI provide Lenthor’s customers with the level of quality assurance necessary in today’s demanding and competitive marketplace.
Share on:
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.