Organic–Inorganic Heterostructures With Programmable Electronic Properties
March 29, 2017 | Technische Universität DresdenEstimated reading time: 2 minutes
Researchers from the University of Strasbourg & CNRS (France), in collaboration with the University of Mons (Belgium), the Max Planck Institute for Polymer Research (Germany) and the Technische Universität Dresden (Germany), have devised a novel supramolecular strategy to introduce tunable 1D periodic potentials upon self-assembly of ad hoc organic building blocks on graphene, opening the way to the realization of hybrid organic–inorganic multilayer materials with unique electronic and optical properties. These results have been published in Nature Communications.
Calculated differential electrical potential induced by a supramolecular lattice of MBB-2 on graphene. The supramolecular lattice is superimposed for clarity. The electrical potential is periodically modulated, with negative values in the region below the molecular heads. Carbon atoms are shown in grey, hydrogen in white, nitrogen in red, fluorine in light blue and chlorine in green.
Vertical stacks of different two-dimensional (2D) crystals, such as graphene, boron nitride, etc., held together by weak van der Waals forces are commonly referred to as “van der Waals heterostructures”. Such sophisticated multilayer structures can be used as a versatile platform for the investigation of various phenomena at the nanoscale. In particular, mechanical superimposition of the 2D crystals generates 2D periodic potentials which impart to system unconventional physical and chemical properties.
Here a team of European researchers applied a supramolecular approach to form self-assembled organic molecular lattices with a controlled geometry and atomic precision on top of graphene, inducing 1D periodic potentials in the resulting organic–inorganic hybrid heterostructures. For that purpose, molecular building blocks were carefully designed and synthesized. Those are equipped with (i) a long aliphatic tail, directing the self-assembly and the periodicity of the potential, and (ii) a photoreactive diazirine head group, whose dipole moment modulates the surface potential of the underlying graphene sheet. Upon irradiation with ultraviolet (UV) light before deposition on graphene, the diazirine moiety is cleaved and a reactive carbene species is formed. The latter is prone to react with solvent molecules, leading to a mixture of new compounds bearing different functionalities.
Scanning tunneling microscope (STM) imaging was used to characterize the nanoscale arrangement of the supramolecular lattices formed on graphite and graphene surfaces, which determines the periodicity and geometry of the induced potentials. Electrical characterization was then performed on graphene-based field-effect devices to assess the effect of the different self-assembled organic layers on the electrical characteristics of the 2D material. Computational simulations allowed to unravel the interactions of the molecular assembly with graphene; a theoretical analysis further confirmed that the origin of the doping effects can be fully attributed to the orientation of electrical dipoles in the head groups. Finally, a periodic potential with the same geometry but a different intensity could be generated from a supramolecular lattice prepared after UV irradiation of the molecular building block in a different solvent.
In this way, the researchers managed to demonstrate that organic supramolecular lattices are suitable to create controllable 1D periodic potentials on the surface of graphene. Interestingly, the periodicity, amplitude and sign of the induced potentials can be pre-programmed and adjusted by careful molecular design. This bottom-up supramolecular approach can be extended and applied to other inorganic 2D materials such as transition metal dichalcogenides, paving the way to more complex multilayer van der Waals heterostructures. These findings are of great importance for the realization of organic–inorganic hybrid materials with controllable structural and electronic properties featuring unprecedented electrical, magnetic, piezoelectric and optical functionalities.
Suggested Items
Key Insights on Photoresist for Defect Reduction
05/21/2025 | I-Connect007 Editorial TeamIn PCB manufacturing, understanding the intricacies of the photoresist process is crucial for achieving high-quality results. Industry experts Josh Krick, a technical service engineer at IEC, and Tim Blair, a PCB imaging specialist at Tim Blair LLC, share their knowledge on the essential stages of photoresist application, highlight critical advancements in materials, and discuss common defects encountered during production. They share best practices and innovative solutions to enhance the manufacturing process, reduce defects, and ensure efficiency and reliability in high-tech applications.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.