Improving Silver Nanowires for FTCEs with Flash Light Interactions
April 7, 2017 | KAISTEstimated reading time: 1 minute

Flexible transparent conducting electrodes (FTCEs) are an essential element of flexible optoelectronics for next-generation wearable displays, augmented reality (AR), and the Internet of Things (IoTs). Silver nanowires (Ag NWs) have received a great deal of attention as future FTCEs due to their great flexibility, material stability, and large-scale productivity. Despite these advantages, Ag NWs have drawbacks such as high wire-to-wire contact resistance and poor adhesion to substrates, resulting in severe power consumption and the delamination of FTCEs.
A research team led by Professor Keon Jae Lee of the Materials Science and Engineering Department at KAIST and Dr. Hong-Jin Park from BSP Inc., has developed high-performance Ag NWs (sheet resistance ~ 5 Ω/sq, transmittance 90 % at λ = 550 nm) with strong adhesion on plastic (interfacial energy of 30.7 J∙m-2) using flash light-material interactions.
The broad ultraviolet (UV) spectrum of a flash light enables the localized heating at the junctions of nanowires (NWs), which results in the fast and complete welding of Ag NWs. Consequently, the Ag NWs demonstrate six times higher conductivity than that of the pristine NWs. In addition, the near-infrared (NIR) of the flash lamp melted the interface between the Ag NWs and a polyethylene terephthalate (PET) substrate, dramatically enhancing the adhesion force of the Ag NWs to the PET by 310 %.
Professor Lee said, “Light interaction with nanomaterials is an important field for future flexible electronics since it can overcome thermal limit of plastics, and we are currently expanding our research into light-inorganic interactions.”
Meanwhile, BSP Inc., a laser manufacturing company and a collaborator of this work, has launched new flash lamp equipment for flexible applications based on the Professor Lee’s research.
Suggested Items
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.
Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications
05/16/2025 | Globe NewswireAccording to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”
CEE PCB to Exhibit at The Battery Show Europe 2025
05/14/2025 | CEE PCBTom Yang, CEO of CEE PCB, has announced that the company will exhibit at The Battery Show 2025, held from June 3-5 at the Messe Stuttgart in Stuttgart, Germany, in Booth F69 in Hall 7.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.