Fidelity in a Marriage Between Electronic and Optical Effects
April 19, 2017 | A*STAREstimated reading time: 1 minute

A key interface component between electronic and light-based circuits receives a boost in performance through A*STAR research that combines previously independent simulations of the two systems. This research highlights the scope to improve electro-optical circuits as critical components in modern communications systems.
Light offers particular advantages over conventional electronics — it can be transmitted with high fidelity over long distances, and can carry much more information. Optical fiber networks exploit these advantages for fast and efficient data communications. The devices at each end of an optical fiber, however, are usually built on conventional electronics, and the performance of this electro-optical interface is a factor that limits the rate of data transmission.
Much research has focused on the development of faster and smaller electro-optical components that can be integrated into conventional silicon-based electronic circuits and microchips. But progress has been hindered by the complexity of simulating both electronic and optical effects in the same device.
Soon Thor Lim and colleagues from the A*STAR Institute of High Performance Computing found a way to combine electronic and optical effects into a single numerical simulation model. They now demonstrate that it can significantly increase the performance of a silicon optical modulator.
“Optical modulators are electro-optical devices that modify the propagating light by applying electrical pulses,” says Lim. “They are used in optical communication systems to encode electronic information into laser beams.”
While there are many fabrication parameters for silicon modulators, there are also many fabrication constraints, and so finding the optimal set of parameters requires painstaking computation.
“The problem is that two types of simulation must usually be performed for such research work – electrical followed by optical simulation using two different types of software. This is computationally expensive in terms of simulation time and resources,” explains Lim. “Our in-house code performs both electrical and optical simulation in one single platform with no loss in data fidelity.”
The team’s method allows the electrical-optical interaction inside the modulator to be visualized by showing the light intensity as an overlay on the modulator’s distribution of electronic properties. The exact position of the nano-scale features and electronic properties can then be fine-tuned to achieve the best optical performance.
“With modeling and optimization using our in-house code, we can design a silicon modulator with best-in-class performance,” says Lim, “which will facilitate the development of low-loss, high-speed optical data transmission systems.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Soaring Inference AI Demand Triggers Severe Nearline HDD Shortages; QLC SSD Shipments Poised for Breakout in 2026
09/16/2025 | TrendForceTrendForce’s latest investigations reveal that the massive data volumes generated by AI are straining the global infrastructure of data center storage.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.