AT&S Tech Enables Evaluation of Fully Integrated GaN-based Multilevel Power Converter
April 25, 2017 | AT&SEstimated reading time: 1 minute
Fraunhofer IAF has developed a fully integrated monolithic multilevel converter in high-volt AlGaN/GaN-on-Si technology. The integrated inverter circuit is designed for maximum voltages of +/- 400 V and currents of 5 A. The multilevel converter on an area of just 2 × 3 mm² comprises four transistors and six diodes. It provides a perfect solution for compact voltage converter applications. It was possible to demonstrate DC/AC inverter operation for American mains voltage. The circuit exhibits minimal dynamic losses at very high frequencies. The excellent switching performance of the multilevel converter was demonstrated with a test setup on the basis of the ECP® technology from AT&S.
A corresponding test setup is necessary in order to evaluate the chip. The packaging of the die constitutes a key factor in this regard. If lateral components are employed, the source, drain and gate pads are on one side and the back of the die is used for heat dissipation. Since the conventional approach with wirebonds imposed restrictions, the second step of the evaluation saw the ECP® technology from AT&S being used. With this technology, the power components – like the multilevel converter – are embedded into the PCB material and can be connected from both sides. The chips are connected directly via copper-plated microvias. This permits low impedance connections and significantly lower inductances compared with wirebond technology. The rear of the die is also connected by means of copper-plated microvias. This ensures excellent heat dissipation.
For more information, click here.
Suggested Items
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.