Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Conductor Analysis Technologies (CAT) Provides Test Systems to TTM Technologies
April 27, 2017 | TTM TechnologiesEstimated reading time: Less than a minute
Conductor Analysis Technologies (CAT) has announced the sale of two OM Thermal Stress Systems to TTM Technologies, Sterling Virginia. “This is a significant step in the adoption of reflow simulation for bare board acceptance by the industry,” said Tim Estes, Chief Technology Officer at CAT.
The OM Thermal Stress System is a cost-effective performance-based reliability test methodology which performs both convection reflow assembly simulation per IPC TM-650 2.6.27 and air-to-air thermal cycling per IPC TM-650 2.6.7.2. The system is configured to perform 230°C and 260°C reflow simulation, as well as -55° to +125°C thermal cycling.
According to Nick Meeker, Chief Operating Officer at CAT, “We have installed a number of test system at OEMs and test laboratories, however this is the first installation at a printed circuit board manufacturer. The systems are scheduled to be installed and operational by mid-August.”
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards, and by material and equipment suppliers to the printed circuit industry. Our products and services provide quantitative data on printed circuit manufacturing capability, quality, and reliability. For more information, click here.
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