Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
MacDermid Enthone Electronics Solutions Releases Affinity ENIG 2.0
May 4, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the Affinity ENIG 2.0 process, a high reliability, low variation electroless nickel immersion gold plating process. Affinity ENIG 2.0 meets the stringent reliability requirements while also providing significant cost benefits to our customers.
Evolved from a combination of the best technologies of our legacy companies and developed using strict six-sigma process methodology, Affinity ENIG 2.0 is the next generation ENIG process from MacDermid Enthone Electronics Solutions. The ability of Affinity 2.0 to provide excellent solderability, uniformity, and reduced waste, including gold consumption, while adhering to all IPC finish requirements makes it a natural choice for PCB fabricators manufacturing for automotive and telecommunications OEMs. Moreover, Affinity 2.0 is able to deliver process consistency so every pad is the same.
John Swanson, Director of Final Finishes, MacDermid Enthone, noted, “The Affinity 2.0 development represents an excellent example of the combined skills and potential of our recently joined companies. Affinity 2.0 brings our customers best in class ENIG reliability, most notably through unmatched nickel corrosion performance and superior gold metal distribution. We look forward to demonstrating the cost and reliability value of Affinity to PCB fabricators, assemblers, and end users throughout this year.“
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there.
For more information, click here.
Share on:
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.