BTU Installs Pyramax Reflow Oven at NextFlex
May 16, 2017 | BTU International, Inc.Estimated reading time: 1 minute
BTU International Inc. has installed a Pyramax 100A demo unit at Silicon Valley-based NextFlex. A public-private consortium of companies, academic institutions, nonprofits and governments, NextFlex's mission is to advance US manufacturing of flexible hybrid electronics (FHE). With this installation, BTU is now able to provide customer demonstrations on the West Coast, located conveniently in the heart of Silicon Valley.
“Pyramax's industry-leading thermal uniformity and unwavering process repeatability make it a great fit for the NextFlex Technology Hub,” said Paul Lancaster, director of sales, Americas for BTU International. “These flexible hybrid circuit products have low thermal mass, making them more challenging to heat uniformly, and this Pyramax system, outfitted with BTU’s proprietary closed-loop convection technology, is perfectly suited for this application.”
The Pyramax 100A was chosen for this lab because of its combination of high yield and low running costs providing a tremendous cost-of-ownership advantage. The oven features 100" of heated length and eight zones, along with 350°C maximum temperature. The system provides excellent thermal uniformity through BTU’s exclusive closed-loop convection control.
“NextFlex will be utilizing the BTU Pyramax to cure conductive inks and adhesives on flexible substrates, a key step in the FHE manufacturing process,” said Jason Marsh, Director of Technology for NextFlex.
About NextFlex
NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. Formed through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. For more information, visit www.nextflex.us and follow NextFlex on LinkedIn, Facebook and Twitter. For more information about NextFlex, visit www.nextflex.us.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.