Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Shengyi Technology Earns UL Listing for FR-4 with RTI of 150°C
May 18, 2017 | Shengyi Technology Co.Estimated reading time: 1 minute
For over 50 years, printed circuit applications using FR-4 as a base material were limited to 130°C continuous maximum operating temperature (MOT). This was more a definition limit set by UL and ANSI rather than a lack of thermal performance by the FR-4 products. Recently, UL changed the definition to allow FR-4 to be used at temperatures up to 150°C if the long term thermal aging (LTTA) data passed the electrical and mechanical requirements.
Shengyi is the first base material supplier world-wide to have an FR-4 product listed with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. The product, S1170G, is a halogen-free epoxy system with a Tg of 180°C and a Td of 390°C designed for lead-free processing. The excellent CAF resistance allows S1170G to be used for high reliability applications including automotive, smartphone, and consumer electronics
The product is listed in Shengyi’s UL File # E109769 as an ANSI Grade FR-15.1. FR-15.1 indicates that it is a halogen-free FR-4 product with RTI of 150°C.
Board designers can feel more comfortable knowing that S1170G can be used at higher temperatures than for traditional FR-4s. Other current FR-4 products will also be listed as
FR-15 in the Shengyi UL file as customer requirements dictate.
About Shengyi Technology Company Ltd.
Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates and prepregs. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials. Shengyi maintains a state-of-the-art manufacturing facility in Dongguan where it manufactures FR4, CEM-1, CEM-3 and a variety of Prepregs. In addition, the company maintains laminate and prepreg manufacturing operations in Suzhou, Shaanxi and Changshu. Shengyi’s products are used in single-sided, double-sided and multilayer printed circuit boards and the company’s global customer base spans a broad spectrum of markets including mobile phones, automotive, telecommunication equipment, computers and higher-level electrical products. For more information can be found here.
Share on:
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.