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June 6, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, will be attending the JPCA Show at Tokyo Big Sight in Tokyo, Japan from June 7-9.
Our technical and management teams will be on site to discuss our latest innovations in the electronics industry including our complete line of primary metallization applications, electrolytic coppers and copper through-hole processes. Systek SAP Copper - Semi Additive Process, ENTEK Plus HT – High Performance OSP, and M-Speed HF, a complete alternative oxide process for high speed/low loss digital PCB applications will also be showcased.
This year, MacDermid Enthone Electronics Solutions is proud to be a silver sponsor for JPCA. Additionally, as members of the Japan MID Association, we will also be present at the 3D MID Pavilion as part of the Monosukuri Fiesta highlighting our full range range of widely specified metallization solutions for Molded Interconnect Devices including MID Copper 100, an electroless copper metallization with superior coverage and adhesion to all DS and LDS plastics, MID SelectCoat 100/200 FL, a sacrificial coating applied before lasering providing fine line plating capability, and our ENPlate LDS line, a full range of final finishes suitable for any applicaiton.
Visit us at Booth 7A-01 for the PWB Tech Exhibition and at Booth 7A-47-14 for the Monotsukuri Fiesta Exhibition. Learn more about this year’s JPCA Show.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics
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