Orbotech at JPCA 2017: Innovative Production Solutions for mSAP, Advanced HDI and Flex
June 9, 2017 | OrbotechEstimated reading time: 5 minutes
Orbotech Ltd., a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, is demonstrating a wide selection of its newest, most innovative, mass production PCB manufacturing solutions for mSAP (modified semi-additive process), advanced HDI and flexible printed circuits at the 2017 JPCA show, June 7-9 in Tokyo Japan.
Among the mSAP enabling innovations Orbotech is presenting at the show are the Orbotech Ultra Fusion 300 AOI solution which now offers new 2D Metrology In-Process Quality Control (IPQC). The company is also demonstrating its Precise 800, the only one-stop AOS solution for opens, nicks & shorts, and Nuvogo Fine 10 DI solution for mSAP, advanced HDI, flexible and rigid PCB patterning. Additionally, the Sprint 200 Flex digital legend inkjet printing solution, optimized for flex multi-panel PCB production, is being shown at the Orbotech booth.
The company is showcasing Orbotech Smart Factory for Industry 4.0 compliant, integrated PCB production. Orbotech Smart Factory, which connects to all Orbotech products, enables real-time production analysis, bi-directional communication and data sharing, enabling traceability and on-demand data analysis. In addition, Orbotech is presenting InCAM Flex, InPlan Flex, InSight PCB, InStack Design and InStack Viewer and its CAM and engineering software solutions for the smart factory.
As a part of the JPCA show’s NPI (New Product Introduction) Seminar, Mr. Kimura Yasushi, Orbotech’s Vice President of Marketing & Products for Japanese Global Accounts will present a session on its Orbotech Smart Factory™ for Industry 4.0. During the seminar, Mr. Yasushi will explain how the new Orbotech Smart Factory solution is truly a partner for Industry 4.0. By self-analyzing and predicting failures and by enabling real-time production analysis, bi-directional communication and traceability, Orbotech Smart Factory helps manufacturers to optimize productivity and responsiveness to production issues.
“Orbotech is proud of our close customer relationships in Asia and of how we continuously work together to deliver leading, accurate solutions for flexible and rigid PCB mass production that help our customers to stay at the forefront of PCB manufacturing,” commented Mr. Yair Alcobi, President of Orbotech Asia East. “The great deal of interest that this market shows in our mSAP solutions and in Orbotech Smart Factory solution is testament to the need for reliable solutions that can significantly improve production processes.”
About Nuvogo Fine 10: Nuvogo Fine 10 is a member of Orbotech’s industry-leading Direct Imaging (DI) solutions for the solutions for the mSAP, advanced HDI & FPC PCB markets. Providing total synergy between Orbotech’s state-of-the-art optics, mechanics and electronics, Nuvogo Fine offers fine resolution (L/S=10/15µm) with superior imaging quality and exceptional throughput. Nuvogo Fine incorporates Orbotech’s field-proven Large Scan Optics (LSO) Technology™, delivering exceptionally high Depth-of-Focus (DoF), and imaging uniformity. It is powered by MultiWave Laser Technology™ which provides optimal resist flexibility.
About Precise 800
The groundbreaking Precise 800 is the first and only ‘one-stop’ Automated Optical Shaping (AOS) solution for mSAP, advanced HDI and complex multi-layer PCB manufacturing market, capable of both ablating excess copper (“shorts”) and depositing missing copper (“opens” and “nicks”), all in a single automated process. Enabling accurate, high quality 3D shaping of the most advanced PCB designs, the Precise 800 significantly increases yield by virtually eliminating PCB scrap. The Precise 800 addresses all defects including those on inner and outer layers, multiple lines, corners and pads.
About Ultra Fusion 300+ 2D Metrology
Ultra Fusion 300 is an mSAP and advanced HDI AOI solution, which is a part of the Orbotech market-leading, high performance AOI family, based on the Multi-Image Technology for superior detection and false-alarm reduction. Orbotech’s Ultra Fusion 300 can now be further enhanced with automated 2D Metrology IPQC (In-process Quality Control), enabling continuous automatic inline measurement of both top and bottom conductor widths, ensuring accurate and repeatable measurements results with fast and simple sampling and advanced traceability.
About Orbotech Smart Factory
Orbotech Smart Factory is Orbotech’s solution for Industry 4.0 and is compatible with all Orbotech solutions. Orbotech Smart Factory’s full automation, traceability, data analysis and bi-directional real time connectivity between all Orbotech systems, enables a centralized database for production monitoring and management reports, full automation with easy to retrieve production data, and full data sharing.
About Sprint 200 Flex
The Sprint 200 Flex Inkjet Printer is Orbotech’s mass production digital legend inkjet printing solution optimized for flex multi-panel PCB production. This latest addition to Orbotech’s family of high performance PCB legend inkjet printers delivers cost-effective, top quality industrial inkjet printing for a consistently accurate production of even the most complex legend designs. The Sprint 200 Flex offers manufacturers breakthrough performance for high volume, high yield and high quality legend and serialization printing over a range of flex PCB materials.
About InCAM Flex, InPlanFlex, InStack and InSight PCB
These pre-production software solutions are smartly connecting and automatingPCB/FPC/IC product and process modeling across design to manufacturing flow, while securing IP and enabling an uncompromised quality. InCAMFlex and InPlan Flex are smart pre-production software solutions for rigid, flex and rigid-flex PCB production. InCAM Flex is a dedicated CAM solution that combines analysis and editing capabilities with automatic production data optimization to perform high-precision CAM tooling for flex and rigid-flex manufacturing. InPlan Flex is a comprehensive automatic engineering system that combines sophisticated engineering know-how with state-of-the-art pre-production planning tools to design the optimal manufacturing process.InStack is an automatic stackup designer dedicated to generating the best possible stackups for quality, manufacturability and price. InSight PCB is a web-based tool for smart and quick incoming customer PCB data assessment for sales people and engineers.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices, designed to enable the production of innovative, next generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality, pattern the desired electronic circuitry on the relevant substrate and perform three dimensional shaping of metalized circuits on multiple surfaces, and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing. For further information, visit orbotech.com.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.