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July 3, 2017 | MatrixEstimated reading time: 1 minute
Recently, there has been a lot of concern in the market regarding the availability of the LCP film that supports copper clad LCP flexible laminates.
In a recently released statement, Matrix USA Inc., a provider of raw materials to the North American PCB industry, reassures customers that the Panasonic Felios R-F705T LCP flexible laminate continues to be available to support the growing market requirements for high-speed, low-loss flexible laminate materials.
Customer and prospects can be assured that the supply chain for the Panasonic Felios R-F705T is secure and material requirements will be supported in the future, according to Matrix USA. Panasonic’s LCP film supplier is currently ramping up capacity to meet growing requirements. Part of this capacity expansion involves a slight reformulation of the LCP film. This new LCP film is currently being tested at Panasonic and once testing is completed samples of the new film will be available for evaluation.
During this transition, the current LCP film and the Panasonic Felios R-F705T laminate material will be readily available and in stock at Matrix USA’s five strategically located warehouses.
There are no changes being made to Panasonic’s new low loss bonding adhesive, R-BM17 that was released last year. This new adhesive provides break-through performance by dramatically simplifying the lamination cycle for pure package multilayer LCP circuits and hybrid rigid-flex designs, the statement added.
Matrix will provide updates on the progress of these changes as they develop over the coming weeks.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, visit www.matrixelectronics.com.
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