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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

KYZEN's Chelsea Jewell to Present on Pre-Immersion Cleaning Chemistries at OCP Global Summit 2026

10/09/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that Chelsea Jewell, KYZEN Application Lab Manager, will present as part of the Open Compute Project (OCP) Global Summit scheduled to take place from October 12-15, 2026, at the San Jose Convention Center in San Jose, California.

SCHMID Pushes Toward the Submicron

10/07/2026 | Marcy LaRont, I-Connect007 Magazine
Fabricators are confronting process requirements today that would have seemed foreign to the PCB shop not long ago, presenting both a promise and a significant manufacturing challenge. SCHMID is one company rising to it in big ways. SCHMID's Laurent Nicolet, VP for the Business Unit PCB, talks about the convergence between PCB fabrication and semiconductor processing as feature sizes shrink, the emergence of glass as an attractive substrate and interposer material, and SCHMID’S embedded trace technology and the work toward moving that technology into high-volume manufacturing.

Bridging the Pacific: What American and Asian PCB Companies Can Learn From Each Other

10/07/2026 | Tianming Liu -- Column: Bridging the Pacific
I have spent much of my career working with people from different countries. Before starting our company in 2009, I lived and worked in Japan for 13 years. Since then, I have worked with customers, suppliers, engineers, and business leaders throughout Asia, North America, and Europe. Those experiences have taught me that no country has all the answers. Every manufacturing culture has strengths, weaknesses, and habits that can be improved.

WIN Semiconductors Adds SawStreet to WIN ALLIANCE

10/05/2026 | EINPresswire.com
WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, announced the addition of Orlando, Florida-based SawStreet LLC to the WIN Alliance Partner Program.
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