Nanometrics Expands Position in Advanced Memory Devices with Atlas for Thin Film Process Control
July 11, 2017 | NanometricsEstimated reading time: 2 minutes
Nanometrics Incorporated today announced that its Atlas systems have been adopted by multiple leading memory manufacturers for production control of thin film deposition processes. Complementing the large installed base of Atlas tools, the Atlas MPU and Atlas III systems are new members of a fleet of solutions that Nanometrics has deployed to enable yield learning and factory control across multiple process steps of the industry's advanced 3D-NAND and DRAM devices.
The Atlas MPU and the Altas III platforms are extensions to the widely deployed Atlas product line, delivering higher productivity and improved thin film metrology performance. Using a common platform architecture strategy, the Atlas MPU is targeted to film applications in customer fabs which have already deployed Atlas XP+ systems into high-volume manufacturing. The Atlas III provides enhanced performance and productivity over the Atlas II+ by enabling sub-angstrom level process control and film metrology capabilities suitable for the most challenging leading-edge device applications. Atlas MPU and Atlas III both leverage Nanometrics' industry-leading NanoDiffract® OCD modeling capabilities.
"The Atlas MPU and Atlas III systems for thin film metrology significantly lowers overall cost-of-ownership and increases operational flexibility within volume manufacturing," commented Dr. Srini Vedula, vice president, Thin Film & OCD Solutions, at Nanometrics. "Our customers recognize the benefit and value of extending their metrology capabilities with new platforms compatible with their existing Atlas fleet. By working closely with them on upgradable options and new system performance, the Atlas MPU and Atlas III enable our customers to maximize their existing investments in our Atlas platforms and solutions while providing significant fab-wide performance and productivity improvements."
About Nanometrics
Nanometrics is a leading provider of advanced, high-performance process control metrology and inspection systems used primarily in the fabrication of semiconductors and other solid-state devices, including sensors, optoelectronic devices, high-brightness LEDs, discretes and data storage components. Nanometrics' automated and integrated metrology systems measure critical dimensions, device structures, topography and various thin film properties, including three-dimensional features and film thickness, as well as optical, electrical and material properties. The company's process control solutions are deployed throughout the fabrication process, from front-end-of-line substrate manufacturing, to high-volume production of semiconductors and other devices, to advanced three-dimensional wafer-level packaging applications. Nanometrics' systems enable advanced process control for device manufacturers, providing improved device yield at reduced manufacturing cycle time, supporting the accelerated product life cycles in the semiconductor and other advanced device markets. The company maintains its headquarters in Milpitas, California, with sales and service offices worldwide. Nanometrics is traded on NASDAQ Global Select Market under the symbol NANO.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.