Creative Materials Intros Flexible Thermally Conductive Epoxy Adhesive
July 13, 2017 | Creative Materials, Inc.Estimated reading time: Less than a minute

Creative Materials, Inc., has introduced 127-31, a unique extremely flexible one-component thermally conductive epoxy adhesive. This 100% solids epoxy adhesive, encapsulant, and potting compound, is electrically insulating, with a thermal conductivity of 3.0 W/mK. 127-31 features thermal stability up to 325°C and excellent chemical resistance.
Unlike conventional epoxy systems, 127-31 can absorb stress when bonding mismatched CTE substrates with low-temperature curing, and offers a 4-day pot life at room temperature. This epoxy also demonstrates elastomeric properties. 127-31 is particularly useful when applications call for silicone-free products.
Typical applications include, printed circuit board fabrication, power management, advanced materials composites, LED attachment, and heat sink bonding.
Products from Creative Materials are used in a variety of applications that provide cost-effective design solutions for demanding production requirements. Creative Materials is ISO 9001 and ISO 14001 certified. The company has extensive experience in the functional adhesive, ink and coating industry, combining technical expertise with nimble production capabilities, enabling a reduction in time-to-market for new product applications. We specialize in custom-developed products. We ask our customers to challenge us to develop the right product for their application.
Suggested Items
Taiwan's PCB Industry Chain Is Expected to Grow Steadily by 5.8% Annually in 2025
05/05/2025 | TPCAAccording to an analysis report jointly released by the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's International Industrial Science Institute, the total output value of Taiwan's printed circuit (PCB) industry chain will reach NT$1.22 trillion in 2024, with an annual growth rate of 8.1%.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand
05/05/2025 | I-Connect007 Editorial TeamDuPont reported higher-than-expected earnings for the first quarter of 2025, supported by increased demand in its electronics and industrial segments. The company’s adjusted earnings per share came in at 79 cents, surpassing the average analyst estimate of 65 cents per share, according to data from LSEG.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.