Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
200mm Fabs Thriving; SEMI’s Updated 200mm Fab Report Now Available
July 14, 2017 | SEMIEstimated reading time: 2 minutes
At SEMICON West in San Francisco, Calif., SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021. SEMI’s analysts updated information on over 100 facilities, including the latest new facilities and investment projects in China. The extensive new report "Global 200mm Fab Outlook to 2021" by SEMI tracks production, pilot, and R&D 200mm facilities worldwide with special attention on capacity expansions and new facilities.
Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009. The capacity decline from 2007 to 2009 was driven by the 2008-2009 global financial crisis, which caused the closure of many facilities, and by the transition of memory and MPU fabrication to 300mm fabs from 200mm.
Since 2009, installed 200mm fab capacity has increased, and by 2020, 200mm capacity is expected to reach almost 5.7 million wafers per month (wpm), and poised to surpass the 2007 peak. According to SEMI’s World Fab Forecast data, by the end of this year, installed capacity will reach close to 5.4 million wpm.
Driven by mobile and wireless applications, IOT, and automotive, the 200mm market is thriving. Many of these products found their niche on 200mm wafers, so companies are expanding capacity in their facilities to the limit, and nine new 200mm facilities are in the pipeline. Looking only at IC volume fabs, the report shows 188 fabs in production in 2016 and expanding to 197 fabs by 2021.China will add most of the 200mm capacity through 2021 with 34 percent growth rate from 2017 to 2021, followed by South East Asia with 29 percent and the Americas with 12 percent.
The Global 200mm Fab Outlook to 2021, published by SEMI in July 2017, includes two files: a 92-page pdf file featuring trend charts, tables and summaries and an Excel file covering 2010 to 2021 detailing on quarterly basis and fab-by-fab developments. This is the third update since the report was first launched in 2015. Since the last report was published in November 2016, the SEMI analyst team has made 232 changes or updates to 132 fabs. The report tracks over 300 facilities using 200mm wafers from R&D, EPI, LED fabs to volume IC fabs.
About SEMI
SEMI connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.