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Global Selective Soldering Equipment Market 2017-2021 - HDI Technology Driving the PCB Market
July 20, 2017 | Business WireEstimated reading time: Less than a minute
The global selective soldering equipment market to grow at a CAGR of 5.53% during the period 2017-2021.
According to the report, one driver in the market is HDI technology driving the PCB market. High density interconnect (HDI) technology is acting as a major driver of the PCB market. With the growing trend of compact devices, there is an increasing need for faster data transfer, thinner packaging along with low power consumption.
This gives rise to the miniaturization of electronic components, resulting in high circuit density that leads to a complex interconnection between components. This is because the overall pin counts along with the pitches (space between two pins) shrink, in turn posing a challenge for PCB manufacturers to produce boards that meet these criteria.
One trend in the market is short product life cycle of electronic devices. Rapid technology changes and constant upgradations have reduced the life cycle of electronic products. This has put immense pressure on OEMs to manufacture new products with reduced lead time to meet market demands.
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