Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

KAGA Electronics Signs Contract Manufacturing Agreement with Star seeds for AI Servers

10/13/2026 | KAGA ELECTRONICS
KAGA ELECTRONICS CO., LTD. hereby announces that it has entered into a basic agreement with Star seeds Co., Ltd., an AI infrastructure provider offering end-to-end solutions entirely within Japan, from GPU procurement to AI data center construction and operation.

TTM Technologies Plans $400M AI Infrastructure Investments in China and Malaysia

10/12/2026 | Globe Newswire
This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.

Mercury Celebrates the Expansion of its Phoenix Production Facility

10/09/2026 | Globe Newswire
Mercury Systems, Inc., a global leader in aerospace and defense electronics, celebrated the expansion of its Phoenix production facility, adding 50,000 sq. ft. of manufacturing space that allows the company to increase production capacity and accelerate delivery timelines through vertical integration to support critical U.S. and international defense programs.

Panasonic Connect to Showcase Automation at SMTAI 2026

10/07/2026 | Panasonic Corporation
Panasonic Connect North America will showcase its latest advances in intelligent automation for electronics manufacturing at SMTA International 2026, taking place October 27–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Advanced and Conventional PCBs Do Not Exist in Separate Supply Chains

10/08/2026 | Jan Pedersen, Engineer and PCB Expert
At the NCAB Norway seminar on Sept. 10, I used a familiar example: a standard six-layer PCB. A year earlier, this would generally have been a straightforward purchase. Prototypes could be supplied on quick turn, and production quantities were commonly available within four to six weeks. Choosing standard materials helped secure a competitive price and predictable delivery. We knew what to expect, and we planned accordingly. We were all happy!
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in