Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
IMPACT Interview: Shane Whiteside, Summit Interconnect
July 28, 2017 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
During Tuesday night’s dinner at IMPACT Washington, D.C. 2017, I-Connect007's Patty Goldman had a chance to talk with Shane Whiteside, Summit Interconnect’s president and CEO.
Goldman: Shane, it’s good to see you. Is this your first time at IMPACT?
Whiteside: This is my first IMPACT. I’ve missed it in previous years, but I’m very pleased to be here.
Goldman: Tell me what you’ve learned in the past day and a half, since arriving.
Whiteside: I’ve been impressed with how IPC has organized a very effective event, and I think that’s not only my impression, but other attendees as well. The people that we’ve met today reflect the influence that IPC has gained in this town, from EPA administrator Scott Pruitt to one of Vice President Pence’s senior advisors, Darius Meeks. It’s just an incredible lineup here today and I think what was really gratifying to me is understanding how much the new administration is aligned with a promoting a very positive industrial policy.
Goldman: It seems everybody is aligning with that, shall we say, and quickly.
Whiteside: There is a lot of enthusiasm with respect to the potential resurgence of U.S. manufacturing. I think that a lot of the people that we met today represent not only new faces, but a new approach as well. The tone is much different, from what I understand, from previous eras. And we’re very much looking forward to the support and the commitments that were made here today to create positive change in our industry.
Goldman: I’m going to put you on the spot a little bit. This morning, a couple of people, including Kim Ford and Robert Irie from the Department of Defense, said, “Get back to us with information—with your needs.” Are you going to act on anything?
Whiteside: I think Kim Ford’s challenge was to get back to her department with what sort of educational needs we can articulate to IPC and their membership can support, or she can support. I think IPC has increased their focus on members’ training needs and is in the best position to respond to Ms. Ford, we will continue to work with IPC in this area. And with the DoD’s request, they’ve spent a lot of time assessing the electronics supply chain in the U.S. and they have a very pragmatic assessment of where the risks are in the supply chain. Where I am concerned about the supply chain is in bare printed circuit board manufacturing, and unfortunately the government’s assessment is still “TBD.” This is due to a 2016 Department of Commerce study that will take until November 2017 to get the results for and allow anyone to really develop an opinion on how to go forward.
To read the full version of this interview which appeared in the July 2017 issue of The PCB Magazine, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.