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Advanced Electronics Packaging Digest

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Trio-Tech Secures $4.45M Burn-In Equipment Contract

10/08/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer.

Teradyne Introduces Titan HP Platform for AI Data Center Devices

10/06/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced a production-ready system that delivers enhanced burn-in capabilities on its Titan™ HP platform.

UL Solutions Completes Acquisition of Eurofins Scientific’s Electrical & Electronics Business

10/02/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced it has completed the acquisition of the electrical and electronics (E&E) business of Eurofins Scientific SE.

VisionWave Highlights STRATUM Autonomous Ground Systems Platform for Defense Operations

09/28/2026 | Globe Newswire
VisionWave Holdings, Inc. highlighted its STRATUM autonomous ground systems architecture, a family of modular unmanned ground platforms, each of which is in development, designed to support multiple defense, security and logistics missions from a common technology foundation.

Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing

09/25/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced a new collaboration supporting research at the Berkeley Wireless Research Center (BWRC) that aims to accelerate and improve testing of next-generation wireless devices.
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