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NextFlex Launches $5.3 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Promote Commercialization of Hybrid Electronics

06/10/2024 | BUSINESS WIRE
NextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, today released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 9.0 project value is expected to exceed $11M (including NextFlex investment and performer cost-share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex’s formation to $143M.

Worldwide AI Chips Revenue to Grow 33% in 2024

05/29/2024 | Gartner, Inc.
Revenue from AI semiconductors globally is expected to total $71 billion in 2024, an increase of 33% from 2023, according to the latest forecast from Gartner, Inc.

GPV Holds Site Engagement Meeting in Estonia

05/21/2024 | GPV
GPV’s Executive Leadership Team met with the local management teams from our Operating Business Units (OBUs) located in best-cost Europe, Mexico and Austria for the third and final Site Engagement Meeting (SEM) this year.

U.S. Companies Invest Heavily in Robots

04/30/2024 | IFR
Manufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.

IDTechEx Report Unveils 3D Electronics Status and Opportunities

04/22/2024 | PRNewswire
3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
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