MEMS & Sensors Executive Congress Answers 'What’s Driving $66B Industry?'
September 8, 2017 | SEMIEstimated reading time: 2 minutes
Lama Nachman will share Intel’s story of using contextually aware computing to improve assistive technology for Stephen Hawking during her keynote at the 13th annual MEMS & Sensors Executive Congress (November 1-2, 2017 in Napa Valley, California). Hosted by MEMS & Sensors Industry Group (MSIG), the event also features NXP’s Lars Reger exploring the critical role of MEMS and non-MEMS sensors in the complex automotive ecosystems of today and tomorrow. Other speakers will address diverse topics spanning ingestible sensors that leverage integrated circuits (ICs), MEMS spectral sensors that improve crop yields, low-power acoustic sensing platforms for always-on voice-activated products, and thin-film pressure-sensitive tiles used for gait and performance analysis.
“Understanding the essential role of MEMS and sensors in integrated systems, such as smart home, smart automotive, smart biomedical/wellness and smart industrial, is critical to extracting maximum value from these devices, which market research firm Yole Développement expects to grow from $38 billion in 2016 to $66 billion in 2021,” said Karen Lightman, vice president, MSIG, a SEMI Strategic Association Partner. “From our keynote speakers to our featured presenters and panelists, MEMS & Sensors Executive Congress speakers will delve into some of the most exciting ways that MEMS and sensors add intelligence and insight to integrated systems.”
Other Highlights
- Emerging MEMS & Sensors: Technologies to Watch ─ Alissa Fitzgerald, A.M. Fitzgerald & Associates
- MEMS & Sensors: Outtakes of 2017 and Outlook for 2018 ─ Jérémie Bouchaud, IHS Markit
- BioMEMS: The Next Big Thing for MEMS Players? ─ Sébastien Clerc, Yole Développement
- Fireside Chat with Industry VCs ─ Wen Hsieh of Kleiner Perkins Caufield & Byers and Rudy Burger of Woodside Capital Partners
- Featured “Tech Talks” on “Creating Six Senses” ─ styled in the manner of TED Talks™, these short talks feature Marcellino Gemelli of Bosch Sensortec and Peter Hartwell of InvenSense/TDK
About MEMS & Sensors Executive Congress
Now in its 13th year, MEMS & Sensors Executive Congress is an annual event that brings together business leaders from a broad spectrum of industries: automotive, communications, consumer goods, energy/environmental, industrial, Internet of Things and biomedical. It is a unique professional forum at which executives from companies designing and manufacturing MEMS/sensors technology sit side-by-side with their end-user customers in panel discussions and networking events to exchange ideas and information about the use of MEMS and sensors in commercial applications.
Premier sponsors of MEMS & Sensors Executive Congress 2017 include: Platinum Sponsor: EV Group; Gold Sponsors: AMEC and SPTS Technologies; Silver Sponsor: Lam Research and NXP; and Bronze Sponsors: Analog Devices, Applied Materials, Okmetic, Tecnisco, ULVAC and X-FAB. Event sponsors include: Coventor, mCube, PNI Sensor and Rogue Valley Microdevices. Media sponsors include: 3D InCites, AZoNano, LUX Research, MEMS & Nanotechnology Exchange, MEPTEC, MIPI Alliance, Semiconductor Packaging News, Sensors Online, Solid State Technology and Yole Développement.
MEMS & Sensors Executive Congress will take place November 1-2, 2017 at the Silverado Resort and Spa in Napa Valley, California.
About SEMI | MEMS & Sensors Industry Group
SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.
Suggested Items
Mycronic High Flex Changes Division Name to PCB Assembly Solutions
05/20/2025 | MycronicMycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.
SEMI Reports Typical Q1 2025 Semiconductor Seasonality with Potential for Atypical Shifts Due to Tariff Uncertainty
05/19/2025 | SEMIAccording to the Q1 2025 Semiconductor Manufacturing Monitor (SMM) Report released by SEMI in collaboration with TechInsights, the global semiconductor manufacturing industry entered 2025 with typical seasonal patterns.
Lockheed Martin Expands Industrial Cooperation in Spain with New PAC-3 MSE Agreement
05/19/2025 | Lockheed MartinLockheed Martin subsidiary Lockheed Martin España S.A. signed a significant industrial cooperation agreement with the Spanish Ministry of Defense, providing the Spanish defense industry with increased engineering and production capability.
Foxconn, NVIDIA to Build AI Factory; Becomes Taiwan’s First NVIDIA Cloud Partner to Power Three Strategic Platforms
05/19/2025 | FoxconnHon Hai Technology Group (Foxconn) announced that it is partnering with NVIDIA and to build a state-of-the-art AI Factory supercomputing center in Taiwan.
Incap Celebrates 40 Years with a Focus on Future Talent and Community Impact
05/19/2025 | IncapIncap Corporation, a global Electronics Manufacturing Services (EMS) provider and one of the top EMS companies in Europe, celebrates its 40th anniversary in 2025 by strengthening its commitment to community engagement and youth development in the regions where it operates.