Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Siemens Introduces Innovator3D IC - a Comprehensive Multiphysics Cockpit for 3D IC Design, Verification and Manufacturing

06/24/2024 | Siemens
Siemens Digital Industries Software announced today Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world.

iTAC, Partners are Enablers for the Battery Factory of the Future

05/29/2024 | iTAC Software AG
In Europe, there was no supplier that could provide the complete system technology for the production of vehicle batteries from a single source. Dürr, iTAC and other partners have changed that.

Bold Breakthroughs: Women Reshaping the Engineering Landscape

06/19/2024 | IPC
IPC is shining a spotlight on the incredible women in the electronics industry who are breaking barriers, making bold breakthroughs, and paving the way for future generations.

Siemens’ Techcellence Awards Recognizes European Digital Transformation and Sustainability Leaders, Innovators and Community Champions

06/11/2024 | Siemens
At Realize LIVE 2024 Europe, held in Munich this week, Siemens Digital Industries Software announced the winners of its Techcellence Awards for Europe.

Collaboration and Data Management the Focus of Latest Podcast From Cadence and I-Connect007

06/19/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology—Data Management,” product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. Hepburn shares his views on how the latest data infrastructures are changing and enabling greater—and safer—data sharing.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in