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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Powering the Future: What Engineers Get Wrong About Designing for Reliability

09/29/2026 | Brian Buyea -- Column: Powering the Future
One question I hear more than almost any other is: How do I design electronics for high reliability? It’s a fair question. In industries like aerospace, defense, EV, and industrial power, reliability isn’t a feature; it’s the product. When things fail, they don’t just fail quietly. They fail catastrophically, expensively, and sometimes dangerously. The truth is that most reliability problems are not discovered in testing. They are designed in from the very beginning, and that’s where engineers—good engineers—get it wrong.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

Flex Connections: Four Lessons in Engineering Judgment for PCB Designers

08/20/2026 | Dan Skweres -- Column: Flex Connections
In my more than four decades in the industry, I’ve watched design tools and manufacturing capabilities evolve in ways we could hardly have imagined when I started, touching everything from conventional rigid boards to today’s highly sophisticated flexible and rigid-flex circuits. But anyone with meaningful experience in the PCB industry can relate to the phrase, “Just because you can doesn’t mean you should.”

Carano and ElectronicsU Debut New Course on Advanced Packaging

09/04/2026 | Nolan Johnson, I-Connect007
Mike Carano is an industry pioneer with deep expertise across multiple domains. In his latest course for the Global Electronics Association’s ElectronicsU platform, “Advanced Packaging: HDI Enabling Technology,” Carano delivers some of the first educational material introducing advanced packaging to the printed circuit supply chain. In this interview, he discusses the course content, target audience, and motivation for creating the course. 

Elementary, Mr. Watson: The Display Revolution, Now With Fewer Tiny Keys

07/23/2026 | John Watson -- Column: Elementary, Mr. Watson
From the earliest days of electronics, engineers have worked within some shared assumptions about how systems should be built and how people should interact with them. These assumptions often feel so natural that they are rarely questioned; they define what "normal" is. Thomas Kuhn, the American philosopher of science best known for introducing the idea of "technical paradigm shifts," observed, "What someone sees depends upon what he looks at and also upon what his previous visual-conceptual experience has taught him to see." In other words, we do not readily notice the framework we are in while using it, nor how it relates to the broader picture of innovation.
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