New Ultralight Silver Nanowire Aerogel is Boon for Energy and Electronics Industries
October 6, 2017 | LLNLEstimated reading time: 1 minute

A new ultralight silver nanowire aerogel could be a boost to the energy and electronics industries.
Metal foams (or porous metals) represent a new class of materials with unique properties including lightweight, high surface area, high electrical conductivity and low thermal conductivity. Lawrence Livermore National Laboratory (LLNL) researchers have created a new ultralight silver nanowire aerogel that could lead to advances in fuel cells, energy storage, medical devices and electronics.
It is so light that it could lay on a fragile rosebud without the flower wilting.
But conventional methods of creating these foams require demanding manufacturing conditions including high temperature, high pressure and/or strict oxygen exclusion. In some cases, they are not scalable for mass production. Using nanowires as building blocks, the fabrication of silver aerogels doesn't have these limitations. In addition, the new silver aerogels have tunable densities, controlled pore structures, improved electrical conductivity and mechanical properties, making it attractive for practical applications.
"The high porosity and excellent mechanical/electrical properties of these silver nanowire aerogels may lead to enhanced device performance and open up new possibilities in fuel cells, energy storage, medical devices, catalysis and sensors," said Fang Qian, lead author of the paper in the most recent online edition of Nano Letters, (link is external)which also will be featured as the journal cover in the December issue.
The new method for fabricating these ultralight, conductive silver aerogels utilizes assemblies of LLNL-made silver nanowires, which can result in low-density monoliths (4.8 mg/cc) that can conform to various geometries. Silver nanowire building blocks were prepared by polyol synthesis and purified by selective precipitation. Silver aerogels were produced by freeze-casting nanowire aqueous suspensions followed by thermal sintering to weld the nanowire junctions.
"We are able to make these ultra-lightweight silver aerogels because the quality of our silver nanowires is extremely high," said Yong Han, principal investigator of the project. "The custom feedstock synthesis capabilities we have at the Lab allow us to create such materials with demanding specifications for diverse application."
Other Livermore researchers on the project include Pui Ching Lan, Megan Freyman, Wen Chen, Tammy Olson, Cheng Zhu, Marcus Worsley, Eric Duoss, Chris Spadaccini and Ted Baumann.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
TTM Technologies, Inc. Announces Retirement Plans of its CEO and Proceeds with CEO Successor Search
08/04/2025 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced that Thomas T. Edman, the company’s President and Chief Executive Officer, intends to retire following the appointment of the company’s next President and CEO.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.