Electrodeposited Copper Foils Market Driven by Hybrid and Electric Vehicles
October 9, 2017 | PRNewswireEstimated reading time: 2 minutes
A new report published by Persistence Market Research titled "Electrodeposited Copper Foils Market: Global Industry Analysis (2012 - 2016) and Opportunity Assessment (2017 - 2025)" studies the performance of the global electrodeposited copper foils market over an eight year assessment period from 2017 to 2025. The report presents the value and volume forecast of the global electrodeposited copper foils market and provides key insights into the factors driving market growth as well as the factors restricting market growth. As per the estimates, the global electrodeposited copper foils market is estimated to be valued at $6,664.4 million by the end of the year 2017 and is poised to touch a value of $ 16005.6 million by the end of the year 2025, registering a CAGR of 11.6% during the assessment period. In terms of volume, the consumption of electrodeposited copper foils was pegged at 384,912 tons in the year 2016 and is expected to touch a figure of 774,918 tons by the end of the year 2025, and exhibit a CAGR of 8.3% during the assessment period.
Global Electrodeposited Copper Foils Market: Segmentation and Forecast
The global electrodeposited copper foils market is segmented on the basis of thickness (50μm) and on the basis of application (Printed Circuit Boards, EMI Shielding, Batteries, Switchgear, others).
By thickness, it is estimated that >50μm segment is estimated to be valued at US$ 689.9 Mn in the year 2017 and is poised to reach a value of $1,073.8 million in the year 2025, exhibiting a CAGR of 5.7% during the forecast period.
By application, the printed circuit boards segment is estimated to be valued at $4,754.6 million in the year 2017 and is expected to reach a value of $ 11,420.9 Million in the year 2025, displaying a CAGR of 11.6% during the assessment period.
By application, EMI shielding segment is estimated to be valued at US$ 83.6 Mn in the year 2017 and is slated to reach a value of $132.2 million in the year 2025, exhibiting a CAGR of 5.9% during the assessment period.
Global Electrodeposited Copper Foils Market: Regional Forecast
Persistence Market Research tracks the performance of the global electrodeposited copper foils market across the key geographies of North America, Latin America, Europe, Asia Pacific and MEA. 5,889.4 Mn in the year 2017 and is slated to reach a value of $ 14,715.9 Mn in the year 2025, exhibiting a CAGR of 12.1% during the period of assessment. Thus, the Asia Pacific region is completely dominating the global electrodeposited copper foils market. North America electrodeposited copper foils market is estimated to be valued at US$ 431.2 Mn in the year 2017, and is poised to reach a value of US$ 741.3 Mn in the year 2025, displaying a CAGR of 7% during the forecast period.
Global Electrodeposited Copper Foils Market: Vendor Insight
The report profiles some of the leading players operating in the global electrodeposited copper foils market such as Mitsui Mining & Smelting Co., Ltd, JX Nippon Mining & Metals Corporation, Jiangxi Copper Corporation, Furukawa Electric Co., Ltd., Nan Ya Plastics Corp., Arcotech Ltd., Kingboard Copper Foil Holdings Ltd, Guangdong Chaohua Technology Co., Ltd., LS MTRON LTD and Chang Chun Petrochemical Co., Ltd. among others. The major suppliers of electrodeposited copper foils are channelizing efforts towards developing partnerships with end users, such as PCB and Battery manufacturers, in order to better address the demand and cater to exacting standards and specific requirements.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.