Biodegradable Electronics
October 13, 2017 | Fraunhofer FEPEstimated reading time: 1 minute
Under the direction of the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP, an in-house Fraunhofer project for development of biodegradable electronics was begun last year. The Fraunhofer Institute for Electronic Nano Systems ENAS, the Fraunhofer Institute for Biomedical Engineering IBMT, the Fraunhofer Institute for Silicate Research ISC, and the Fraunhofer Resource Recycling and Strategy Project Group IWKS are working together on the project.
Electronic components that are completely broken down in a biological environment after a pre-defined operating life open up novel applications as well as ways for reducing their ecological footprint.
One enabling technology for such components is the manufacture of biodegradable conductive traces on biodegradable substrates using vacuum technologies. This technology was developed by Fraunhofer FEP.
A novel application area for these innovative electronic components for example is in the field of active medical implants that after expiration of their operating life are resorbed by tissue, thereby sparing the patient a second surgical intervention.
The Fraunhofer Gesellschaft e. V. is now funding the "bioElektron - Biodegradable Electronics for Active Implants" project through its in-house program (funding No. MAVO B31 301). The goal of the project is the development of essential components for biodegradable electronic parts that can be employed for example in an implant.
This includes in particular:
- biodegradable conductor structures
- biodegradable electrodes for collecting electrical signals or delivering electrical stimulation
- biodegradable thin-film transistors and circuitry
- biodegradable barrier coatings as moisture and gas barriers, and electrical insulation layers
These elements will be monolithically integrated into a flexible thin-film device.
Conductor structures and organic thin-film transistors are being developed at Fraunhofer FEP using vacuum technology. Deposition of magnesium via thermal evaporation under high vacuum conditions is being used as an enabling technology for this purpose. Magnesium is known for being a biodegradable and biologically compatible metal that is already employed in clinical environments as an absorbable implant material. The challenge consists of depositing this metal upon biodegradable polymer films that magnesium does not adhere sufficiently to under normal process control. By suitably pre-treating the substrates using a combination of drying, plasma treatment, and utilization of seed layers, finely structured high-quality conductor structures were able to be produced.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor's Choice: Five Most-Read Articles for 2025
01/02/2026 | Michelle Te, I-Connect007Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.
Foxconn, Pace CCS Launch Taipei Carbon Capture Lab
12/31/2025 | FoxconnFoxconn Technology Group and Pace CCS , a leading UK-based company in carbon capture and storage (CCS) design , jointly announced the opening of a laboratory in Taiwan to develop chemical injection technology to effectively prevent corrosion of internal CCS pipelines.
Trackonomy, CTT Partner on Ultra-Miniature Tracking
12/31/2025 | PRNewswireTrackonomy, a global leader in miniaturization of complex sensing and automation technologies, announced a strategic partnership with Cellular Tracking Technologies (CTT) to accelerate the development and deployment of next-generation miniature tracking solutions.
Denny Fritz: A Hall-of-Fame Career in PCBs
12/30/2025 | Marcy LaRont, PCB007 MagazineFrom DuPont to the Navy’s top electronics programs, Defense Speak Interpreted columnist Dennis “Denny” Fritz has devoted his career to advancing defense technology and collaboration. In this interview, Denny reflects on decades of leadership, service, and innovation, offering timeless advice on staying technically active and leading with purpose.
Cutting Through the Noise in Component Sourcing
12/29/2025 | Brittany Martin, I-Connect007Every engineer knows the pain of searching for parts—it’s often slow, frustrating, and outdated, more like flipping through a phone book than using modern technology. Despite decades of progress in electronics, component sourcing remains one of the industry’s most tedious and time-consuming tasks.