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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

05/20/2025 | Deca Technologies
Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.

Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics

05/20/2025 | Jerome Larez -- Column: Global PCB Connections
In the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.

Global PCB Market Forecast to Reach $86.5 Billion by 2029 with 5.9% Annual Growth

05/19/2025 | EINPresswire.com
The printed circuit board market size has witnessed steady growth in recent years and the trend is anticipated to continue. Increasing from $65.82 billion in 2024 to $68.75 billion in 2025, it showcases a compound annual growth rate CAGR of 4.5%.

Seoul Semiconductor, Seoul City Join Forces to Enhance Public Safety

05/19/2025 | BUSINESS WIRE
Seoul Semiconductor Co., Ltd.a leading global innovator of LED products and technology, announced that it has signed a “Standard Safety Design Agreement” with the Seoul Metropolitan Government to enhance citizen safety in tunnels and underpasses throughout the city.

Connection Wins Intel Partner of the Year Award for AI PC

05/16/2025 | BUSINESS WIRE
Connection, a leading information technology solutions provider to business, government, healthcare, and education markets, is pleased to announce that it has received Intel’s 2025 Partner of the Year award for AI PC. Connection earned this distinction for demonstrating exceptional technology innovation and collaboration in developing solutions and marketing strategies.
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