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Advanced Electronics Packaging Digest

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United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion

Infineon Completes Acquisition of C2i Semiconductors

10/07/2026 | Infineon
Infineon Technologies AG announced the completion of its acquisition of C2i Semiconductors, a Bengaluru-based technology company specializing in software-defined multiphase controllers and smart power stages for AI data center applications.

Dymax Adds New Location, Prepares for SMTA Guadalajara

09/28/2026 | I-Connect007
Dymax is among the companies looking to strengthen its presence in Mexico. Raul Garcia speaks with Nolan Johnson about an expanded presence through a new warehouse in Querétaro, which provides technical and lab support, and the products that Dymax will have on display at SMTA Guadalajara Expo & Tech Forum, Oct. 7–8. These products are designed to speed up production rates and be more energy efficient.

Rehm Thermal Systems Readies for SMTA Guadalajara

09/23/2026 | Nolan Johnson, I-Connect007
In this interview, Nolan Johnson speaks with Rehm Mexico General Manager Luis Garcia about the growing electronics manufacturing market in Mexico, renewed investment in production equipment, and increasing demand driven by AI, automotive, electromobility, and medical applications. Garcia also discusses Rehm’s expanding technology portfolio and what the company will showcase at SMTA Guadalajara.

Mexico Solders On With Indium Corporation

09/16/2026 | Nolan Johnson, SMT007 Magazine
It makes sense to go where the customers are, which is why Indium Corporation recently opened a new solder paste manufacturing facility in Guadalajara, Mexico. Chris Bastecki, vice president of the Americas Sales and Service Group at Indium Corporation, as well as vice president of PCB Assembly Materials, discusses the reasons behind the new facility, the growing market segments, and the challenges of matching solder to specific applications.
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